Deliberating upon process modifications for surfactant induced electroless plating (SIEP), this article highlights the plating bath performance characteristics for two distinct reducing agent contacting modes (bulk and drop wise). Eventually, the effect of reducing agent concentration (50, 100,200% excess) suitable for electroless plating bath for a nickel concentration of 0.08 mol/L was investigated. Finally, the compatibility of variation in nickel concentration (0.08-0.24 mol/L) with respect to variation in reducing agent concentration (50, 100, 200% excess) was investigated. LPSA, BET, FUR, XRD, FESEM and nitrogen permeation experiments were used for surface and physical characterization. It was observed that for the bulk addition of reducing agent, the PPD values were 84.5% which increased to 89.3% for dropwise addition case. Thus the optimal combinations of SIEP process parameters were identified as 0.08 mol/L of nickel metal solution concentration with 100% excess drop-wise reducing agent. These conditions provided a plating rate of 5.5 x 10(-5) mol/m(2) s, PPD of 89.3% and a metal film thickness of 15.7 mu m respectively after 12 h of sequential plating. (C) 2014 Elsevier B.V. All rights reserved.