Korean Journal of Materials Research, Vol.13, No.12, 775-778, December, 2003
BCl 3 기반의 혼합가스들을 이용한 InP 고밀도 유도결합 플라즈마 식각
High Density Inductively Coupled Plasma Etching of InP in BCl 3 -Based Chemistries
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We studied InP etching in high density planar inductively coupled BCl 3 and BCl 3 /Ar plasmas(PICP). The investigated process parameters were PICP source power, RIE chuck power, chamber pressure and BCl 3 /Ar gas composition. It was found that increase of PICP source power and RIE chuck power increased etch rate of InP, while that of chamber pressure decreased etch rate. Etched InP surface was clean and smooth (RMS roughness \AA /min) after the planar BCl 3 /Ar ICP etching. It may make it possible to open a new regime of InP etching with CH 4 H 2 -free plasma chemistry. Some amount of Ar addition (
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