기계적 합금화에 의해 제조된 Skutterudite CoSb 3 의 열전특성

최문관; 조경원; 어순철; 김일호; Moon-Kwan Choi; Kyoung-Won Cho; Soon-Chul Ur; Il-Ho Kim

Korean Journal of Materials Research, Vol.14, No.11, 802-806, November, 2004

DOI10.3740/MRSK.2004.14.11.802 Export Citation

기계적 합금화에 의해 제조된 Skutterudite CoSb 3 의 열전특성

Thermoelectric Properties of Skutterudite CoSb 3 Fabricated by Mechanical Alloying Process

최문관, 조경원, 어순철 ^†, 김일호

충주대학교 신소재공학과/나노기술연구소

Moon-Kwan Choi, Kyoung-Won Cho, Soon-Chul Ur^†, and Il-Ho Kim

Department of Materials Science and Engineering/Nano Technology Lab., Chungju National University, Chungju, Chungbuk 380-702, Korea

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Skutterudite CoSb 3 powders were produced by mechanical alloying (MA) of elemental powders using a nominal stoichiometric composition. Annealing of MA powders under specific condition led to a complete phase transformation to a semiconducting δ?CoSb 3 . Single phase CoSb 3 was successfully produced by vacuum hot pressing using MA powders without subsequent annealing. Phase transformations during mechanical alloying and hot pressing were systematically investigated using XRD and SEM. Thermoelectric properties as a function of temperature were evaluated for the hot pressed specimens and compared with results of analogous studies.

Keywords:mechanical alloying;thermoelectric;hot pressing;skutterudite

[References]

Nolas GS, Morelli DT, Tritt TM, Annu. Rev. Mater. Sci., 29, 89 (1999)
Nolas GS, Lyon HB, Cohn JL, Tritt TM, Slack GA, 16th Intl. Conf. on Thermoelectrics, Dresden, Germany, 1997, IEEE, pp. 321-325 (1997)
Caillat T, Borschchevsky A, Fleurial JP, J. Appl. Phys., 80(8), 4442 (1996)
Sharp JW, Jones EC, Williams RK, Martin PM, Sales BC, J. Appl. Phys., 78(2), 1013 (1995)
Caillat, Borshchevski A, Fleurial JP, 13th Intl. Conf. Thermoelectrics, Kansas City, Missouri, USA, American Institute of Physics, (1994), pp. 58-61 (1994)
Yang J, Chen YC, Peng J, Song X, Zhu W, Su J, Chen R, J. of Alloying and Compound, 375, 229 (2004)
Kawaharada Y, Kurosaki K, Uno M, Yamanaka S, J. Alloy. Compd., 315, 193 (2001)
Jang JX, Lu QM, Liu KG, Zhang L, Zou ML, Materials Letters, 58, 1981 (2004)
Ur SC, Nash P, Kim IH, J. Alloy. Compd., 361(1), 84 (2003)
Rowe DM, Schukla VS, J. Appl. Phys., 52(12), 7421 (1981)

[Referenced By]

[Related Articles]

[1] Nolas GS, Morelli DT, Tritt TM, Annu. Rev. Mater. Sci., 29, 89 (1999)

[2] Nolas GS, Lyon HB, Cohn JL, Tritt TM, Slack GA, 16th Intl. Conf. on Thermoelectrics, Dresden, Germany, 1997, IEEE, pp. 321-325 (1997)

[3] Caillat T, Borschchevsky A, Fleurial JP, J. Appl. Phys., 80(8), 4442 (1996)

[4] Sharp JW, Jones EC, Williams RK, Martin PM, Sales BC, J. Appl. Phys., 78(2), 1013 (1995)

[5] Caillat, Borshchevski A, Fleurial JP, 13th Intl. Conf. Thermoelectrics, Kansas City, Missouri, USA, American Institute of Physics, (1994), pp. 58-61 (1994)

[6] Yang J, Chen YC, Peng J, Song X, Zhu W, Su J, Chen R, J. of Alloying and Compound, 375, 229 (2004)

[7] Kawaharada Y, Kurosaki K, Uno M, Yamanaka S, J. Alloy. Compd., 315, 193 (2001)

[8] Jang JX, Lu QM, Liu KG, Zhang L, Zou ML, Materials Letters, 58, 1981 (2004)

[9] Ur SC, Nash P, Kim IH, J. Alloy. Compd., 361(1), 84 (2003)

[10] Rowe DM, Schukla VS, J. Appl. Phys., 52(12), 7421 (1981)