전산모사에 의한 웨이브 히트싱크의 열유동 특성 해석

이인규; 이상웅; 강계명; 장시영; In-Gyu Lee; Sang-Woong Lee; Kae-Myung Kang; Si-Young Chang

Korean Journal of Materials Research, Vol.14, No.12, 870-875, December, 2004

DOI10.3740/MRSK.2004.14.12.870 Export Citation

전산모사에 의한 웨이브 히트싱크의 열유동 특성 해석

Heat Flow Analysis in the Newly Developed Wave Heat Sink by Computational Simulation

이인규 ^†, 이상웅, 강계명 ¹, 장시영

한국항공대학교 항공재료공학과
¹서울산업대학교 신소재공학과

In-Gyu Lee^†, Sang-Woong Lee, Kae-Myung Kang¹, and Si-Young Chang

Department of Materials Engineering, Hankuk Aviation University, Gyeonggi-do, 412-791, Korea
¹Department of Materials Science and Engineering, Seoul National University of Technology, Seoul, 139-743, Korea

E-mail:

Heat flow characteristics in the newly developed Wave Heat Sink were analyzed under natural and forced convections by Icepak program using the finite volume method. Temperature distribution and thermal resistance of Wave Heat Sink with/without air vent hole on the top of fin were compared with those of a commercial Al extruded heat sink(Intel Heat Sink). Under the natural convection, the maximum temperature was 45.1 ? C in the air vent hole typed Wave Heat Sink, which was superior to that of Intel Heat Sink. The thermal resistance was 2.51 ? C/W in the air vent hole typed Wave Heat Sink, and it changed to 2.65 ? C/Wand2.16 ? C/W with changes of gravity direction and fin height, respectively. Under the forced convection, the maximum temperature became lower than that under the natural convection. In addition, the thermal resistance lowered in the air vent hole typed Wave Heat Sink with higher fin height and it decreased with increasing the air flux.

Keywords:wave heat sink;natural / forced convection;heat flow;thermal resistance

[References]

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Kim YH, Rhee GH, J. of the Institute of Information and Technology, 5, 8 (2003)
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Chien HC, Tseng MH, Wang CY, Chu CH, Seventeenth Annual IEEE Symposium, 20 (2001)

[Referenced By]

[Related Articles]

[1] Gromoll B, IEEE-Proceedings of the Comp. Euro, 1992, 304 (1992)

[2] Peterson GP, Ortega A, Thermal Control of Electronic Equipment and Devices, Vol. 20, p.181, Hartnett JP, Academic Press, San Diego, (1990) (1990)

[3] Bar-Cohen A, Kraus AD, Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2, p.41, ASME Press Series, New York, (1990) (1990)

[4] Pecht M, Handbook of Electronic Package Design, p40, Marcel Dekker, Inc., New York, (1990) (1990)

[5] Yang SY, The Society of Air-Conditioning and Refrigerating Engineers of Korea, 29(6), 90 (2000) (2000)

[6] Shah A, Sammakia B, Srihari H, Thermal and Thermomechanical Phenomena in Electronic Systems, The Eighth Intersociety Conference on Thermal Phenomena, 298 (2002) (2002)

[7] Kim YH, Rhee GH, J. of the Institute of Information and Technology, 5, 8 (2003)

[8] Yang MC, Seventeenth Annual IEEE Symposium, 102 (2001)

[9] Chien HC, Tseng MH, Wang CY, Chu CH, Seventeenth Annual IEEE Symposium, 20 (2001)