수열처리에 의한 세리아가 코팅된 실리카 연마재의 제조 및 Oxide Film의 연마특성

유대선; 김대성; 이승호; Dae Sun Ryu; Dae Sung Kim; Seung-Ho Lee

Korean Journal of Materials Research, Vol.15, No.12, 818-823, December, 2005

DOI10.3740/MRSK.2005.15.12.818 Export Citation

수열처리에 의한 세리아가 코팅된 실리카 연마재의 제조 및 Oxide Film의 연마특성

Preparation of Ceria Coated Silica Abrasive by Hydrothermal Treatment and Polishing Rate on Oxide Film

유대선, 김대성, 이승호 ^†

요업기술원 복합재료센터

Dae Sun Ryu, Dae Sung Kim, and Seung-Ho Lee^†

Composite Materials Center, Korea Institute of Ceramic Eng. & Tech, Seoul 153-801, Korea

E-mail:

Sub-micron colloidal silica particles coated with nano-sized ceria were prepared by mixing of its silica and cerium salts hydrolysis, and modified by hydrothermal reaction. By using the slurries with and without hydrothermal modification containing above particles, oxide film coated on silicon wafer was polished. The modified slurries had higher polish rate due to increase of ceria fraction to silica through hydrothermal reaction. They revealed higher stability in wide range of pH [Math Processing Error] than ceria coated silica slurries without its modification.

Keywords:ceria coated silica;hydrothermal treatment;CMP;abrasive;nano-sized ceria

[References]

Nojo H, Kodera M, Nakata R, IEEE, 96, 349 (1996)
Hoshino T, Kurata Y, Terasaki Y, Susa K, J. NonCryst. Solids, 283, 129 (2001)
Cook LM, J. Non-Cryst. Solids, 120, 152 (1990)
Brands R, Konthe T, Klaessig F, Menzel F, Lortz W, Varga G, CMP-MIC Conference, 73 (2003)
Lee SH, Lu Z, Babu SV, Metijevic E, J. Mater. Res., 17, 2744 (2002)
Lakhwani S, Rahaman MN, J. Mater. Res., 14, 1455 (1999)
Hirano M, Fukuda Y, Iwata H, Hotta Y, Inagaki M, J. Am. Ceram. Soc., 83(5), 1287 (1993)
Hirano M, Kato E, J. Am. Ceram. Soc., 79, 777 (1996)
Chen PL, Chen IW, J. Am. Ceram. Soc., 76(5), 1577 (1993)
Hsu WP, Ronnquist L, Metijevic E, Langmuir, 4, 31 (1988)
Steigerwald JM, Murarka SP, Gutman RJ, 'Chemical Mechanical Planarization of Microelectronic Materials', John Wiely & Sons, p 40 (1997) (1997)
Ko PJ, Park SW, Kim NH, Seo YJ, Lee WS, J. Korea Institute of Electrical and Electronic Mater. Eng.,, 18, 219 (2005)
Lu Z, Lee SH, Gorantla VRK, Babu SV, Metijevic E, J. Mater. Res., 18, 2323 (2003)
Hanawa K, Mochizuki N, Ueda N, U.S. Patent 5938837 (1999) (1999)
Iler RK, 'The chemistry of silica,' John Wiely & Sons, p 48 (1979) (1979)
Goto K, J. Chem. Soc. Jap. Pure Chem. Sect., 76, 1364 (1955)

[Referenced By]

[Related Articles]

[1] Nojo H, Kodera M, Nakata R, IEEE, 96, 349 (1996)

[2] Hoshino T, Kurata Y, Terasaki Y, Susa K, J. NonCryst. Solids, 283, 129 (2001)

[3] Cook LM, J. Non-Cryst. Solids, 120, 152 (1990)

[4] Brands R, Konthe T, Klaessig F, Menzel F, Lortz W, Varga G, CMP-MIC Conference, 73 (2003)

[5] Lee SH, Lu Z, Babu SV, Metijevic E, J. Mater. Res., 17, 2744 (2002)

[6] Lakhwani S, Rahaman MN, J. Mater. Res., 14, 1455 (1999)

[7] Hirano M, Fukuda Y, Iwata H, Hotta Y, Inagaki M, J. Am. Ceram. Soc., 83(5), 1287 (1993)

[8] Hirano M, Kato E, J. Am. Ceram. Soc., 79, 777 (1996)

[9] Chen PL, Chen IW, J. Am. Ceram. Soc., 76(5), 1577 (1993)

[10] Hsu WP, Ronnquist L, Metijevic E, Langmuir, 4, 31 (1988)

[11] Steigerwald JM, Murarka SP, Gutman RJ, 'Chemical Mechanical Planarization of Microelectronic Materials', John Wiely & Sons, p 40 (1997) (1997)

[12] Ko PJ, Park SW, Kim NH, Seo YJ, Lee WS, J. Korea Institute of Electrical and Electronic Mater. Eng.,, 18, 219 (2005)

[13] Lu Z, Lee SH, Gorantla VRK, Babu SV, Metijevic E, J. Mater. Res., 18, 2323 (2003)

[14] Hanawa K, Mochizuki N, Ueda N, U.S. Patent 5938837 (1999) (1999)

[15] Iler RK, 'The chemistry of silica,' John Wiely & Sons, p 48 (1979) (1979)

[16] Goto K, J. Chem. Soc. Jap. Pure Chem. Sect., 76, 1364 (1955)