레이저를 이용한 차세대 평판 디스플레이 공정

김광열; Kwang-Ryul Kim

Korean Journal of Materials Research, Vol.17, No.7, 352-357, July, 2007

DOI10.3740/MRSK.2007.17.7.352 Export Citation

레이저를 이용한 차세대 평판 디스플레이 공정

Laser Microfabrications for Next-Generation Flat Panel Display

김광열^†

부산대학교 하이브리드소재 솔루션 국가핵심 연구센터

Kwang-Ryul Kim^†

National Core Research Center for Hybrild Materials Solution, Pusan National University, Busan 609-735, South Korea

E-mail:

Since a pattern defects "repair" system using a diode pumped solid state laser for Flat Panel Display (FPD) was suggested, a lot of laser systems have been explored and developed for mass-production microfabrication process. A maskless lithography system using 405 nm violet laser and Digital Micromirror Device (DMD) has been developed for PDP and Liquid Crystal Display (LCD) Thin Film Transistor (TFT) photolithography process. In addition, a "Laser Direct Patterning" system for Indium Tin Oxide (ITO) for Plasma Display Panel(PDP) has been evaluated one of the best successful examples for laser application system which is applied for mass-production lines. The "heat" and "solvent" free laser microfabrications process will be widely used because the next-generation flat panel displays, Flexible Display and Organic Light Emitting Diode (OLED) should use plastic substrates and organic materials which are very difficult to process using traditional fabrication methods.

Keywords:Laser Direct Patterning;Maskless Lithography;Digital Micromirror Device(DMD);Flat Panel Display

[References]

Kim ST, Proceedings of IMIDIIDMC, Keynote Address (2006) (2006)
Kwon SH, Lee SG, Cho WK, Ruy BG, Song BM, Proceedings of Society of Information Display, 1838 (2006)
Suzuki A, Proceedings of IMID/IDMC, 521 (2006)
Niven G, Mooradian A, Proceedings of Society of Information Display, 1904 (2006)
Kahn A, Shiyanovskaya I, Schneider T, Doane JW, Proceedings of Society of Information Display, 1728 (2006)
Groves TR, Pickard D, Rafferty B, Crosland N, Adam D, Schubert G, Microelectronic Engineering, 61, 28 (2002)
Chan K, Feng Z, Yang R, Mei W, Proceedings of SPIE, 4985, 37 (2003)
Pease RF, Microelectronic Engineering, 78, 381 (2005)
Liu C, Guo X, Gao F, Luo B, Duan X, Du J, Qiu C, Proceedings of SPIE, 5645, 307 (2005)
Kim KR, Park IT, Kim HW, Lee YW, Cho CH, Kang HS, Hong SK, Lee SB, Proceedings of ICALEO, M807 (2005)
Streitz O, Proceedings of IMID/IDMC, 337 (2006)
Kim KR, Ko SC, Park HK, Korean Society for Precision Engineering Spring Conference, 932 (2002)
Herbs L, Paetzel R, Simon F, Fechner B, Proceedings of IMID/IDMC, 540 (2006)
Grenon BJ, Hamaker HC, Buck PD, Microelectronic Engineering, 27, 225 (1995)
Harry S, Microelectronic Engineering, 35, 177 (1997)
Peng K, Zhang F, Wu G, Gu W, Sun X, Kang N, Pu Q, Ding Z, Microelectronic Engineering, 61, 277 (2002)
Harvey EC, Rumsby PT, Proceedings of SPIE, 3223, 2332 (1997)
Rizvi NH, SPIE Conference on Design, Test and Microfabrication of MEMS and MOEMS, 3680, 546 (1999)
Callewaert K, Martele Y, Breban L, Naessens K, Vandaele P, Baets R, Geuskens G, Schacht E, Applied Surface Science, 208 (2003)
Zhou L , Wanga A, Wu SC, Sun J, Park S, Jackson TN, Appl. Phys. Lett., 88, 083502 (2006)
Kim KR, Kang HS, Hong HK, Korean Information Display Society Workshop for Next Generation FPD Manufacturing Systems, Invited (2005) (2005)
Kim DH, Kim DJ, Proceedings of IMIDIIDMC, 647 (2006)

[Referenced By]

[1] Kim ST, Proceedings of IMIDIIDMC, Keynote Address (2006) (2006)

[2] Kwon SH, Lee SG, Cho WK, Ruy BG, Song BM, Proceedings of Society of Information Display, 1838 (2006)

[3] Suzuki A, Proceedings of IMID/IDMC, 521 (2006)

[4] Niven G, Mooradian A, Proceedings of Society of Information Display, 1904 (2006)

[5] Kahn A, Shiyanovskaya I, Schneider T, Doane JW, Proceedings of Society of Information Display, 1728 (2006)

[6] Groves TR, Pickard D, Rafferty B, Crosland N, Adam D, Schubert G, Microelectronic Engineering, 61, 28 (2002)

[7] Chan K, Feng Z, Yang R, Mei W, Proceedings of SPIE, 4985, 37 (2003)

[8] Pease RF, Microelectronic Engineering, 78, 381 (2005)

[9] Liu C, Guo X, Gao F, Luo B, Duan X, Du J, Qiu C, Proceedings of SPIE, 5645, 307 (2005)

[10] Kim KR, Park IT, Kim HW, Lee YW, Cho CH, Kang HS, Hong SK, Lee SB, Proceedings of ICALEO, M807 (2005)

[11] Streitz O, Proceedings of IMID/IDMC, 337 (2006)

[12] Kim KR, Ko SC, Park HK, Korean Society for Precision Engineering Spring Conference, 932 (2002)

[13] Herbs L, Paetzel R, Simon F, Fechner B, Proceedings of IMID/IDMC, 540 (2006)

[14] Grenon BJ, Hamaker HC, Buck PD, Microelectronic Engineering, 27, 225 (1995)

[15] Harry S, Microelectronic Engineering, 35, 177 (1997)

[16] Peng K, Zhang F, Wu G, Gu W, Sun X, Kang N, Pu Q, Ding Z, Microelectronic Engineering, 61, 277 (2002)

[17] Harvey EC, Rumsby PT, Proceedings of SPIE, 3223, 2332 (1997)

[18] Rizvi NH, SPIE Conference on Design, Test and Microfabrication of MEMS and MOEMS, 3680, 546 (1999)

[19] Callewaert K, Martele Y, Breban L, Naessens K, Vandaele P, Baets R, Geuskens G, Schacht E, Applied Surface Science, 208 (2003)

[20] Zhou L , Wanga A, Wu SC, Sun J, Park S, Jackson TN, Appl. Phys. Lett., 88, 083502 (2006)

[21] Kim KR, Kang HS, Hong HK, Korean Information Display Society Workshop for Next Generation FPD Manufacturing Systems, Invited (2005) (2005)

[22] Kim DH, Kim DJ, Proceedings of IMIDIIDMC, 647 (2006)