Electrodeposition of GMR Ni/Cu Multilayers in a Recirculating Electrochemical Flow Reactor

Youngwoo Rheem

Korean Journal of Materials Research, Vol.20, No.2, 90-96, February, 2010

DOI10.3740/MRSK.2010.20.2.90 Export Citation

Electrodeposition of GMR Ni/Cu Multilayers in a Recirculating Electrochemical Flow Reactor

Youngwoo Rheem^†

Department of Chemical and Environmental Engineering, University of California-Riverside, Riverside, CA 92521, Korea

E-mail:

The recirculating electrochemical flow reactor developed at UCLA has been employed to fabricate nanostructured GMR multilayers. For comparison, Ni/Cu multilayers have been electrodeposited from a single bath, from dual baths and from the recirculating electrochemical flow reactor. For a magnetic field of 1.5 kOe, higher GMR (Max. -5%) Ni/Cu multilayers with low electrical resistivity (< 10 μΩ·cm) were achieved by the electrochemical flow reactor system than by the dual bath (Max. GMR = -4.2% and < 20 μΩ·cm) or the single bath (Max. GMR = -2.1% and < 90 μΩ·cm) techniques. Higher GMR effects have been obtained by producing smoother, contiguous layers at lower current densities and by the elimination of oxide film formation by conducting deposition under an inert gas environment. Our preliminary GMR measurements of Ni/Cu multilayers from the electrochemical flow reactor obtained at low magnetic field of 0.15 T, which may approach or exceed the highest reported results (-7% GMR) at magnetic fields > 5 kOe.

Keywords:GMR;Ni/Cu multilayer;recirculating electrochemical flow reactor;electrodeposition

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[3] Dini JW, Plat. & Surf. Fin., 80(1), 26 (1993)

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[6] Ross CA, Annu. Rev. Mater. Sci., and references cited therein, 24, 159 (1994)

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[8] Myung NV, Ryu KH, Kim JH, Schwartz M, Nobe K, Mater. Res. Soc. Symp. Proc., 562 (1998)

[9] Lashmore DS, Dariel MP, J. Electrochem. Soc., 135, 1218 (1988)

[10] Szczurek T, Rausch T, Schlesinger M, Snyder DD, Olk CH, J. Electrochem. Soc., 145(5), 1777 (1999)

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[15] Toth J, Kiss LF, Toth-Kadar E, Dinia A, Pierron-Bohnes V, Bakonyi I, J. Magn. Magn. Mater., 199, 243 (1999)

[16] Menezes S, Anderson DP, J. Electrochem. Soc., 137, 440 (1990)

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[19] Bakonyi I, Toth-Kadar E, Becsei T, Toth J, Tarnoczi T, Cziraki A, Gerocs I, Nabiyouni G, Schwarzacher W, J. Magn. Magn. Mater., 156, 347 (1996)

[20] Blondel A, Doudin B, Ansermet JP, J. Magn. Magn. Mater., 165, 34 (1997)