플립칩용 에폭시 접착제의 저온 속경화 거동에 미치는 경화제의 영향

최원정; 유세훈; 이효수; 김목순; 김준기; Won-Jung Choi; Se-Hoon Yoo; Hyo-Soo Lee; Mok-Soon Kim; Jun-Ki Kim

Korean Journal of Materials Research, Vol.22, No.9, 454-458, September, 2012

DOI10.3740/MRSK.2012.22.9.454 Export Citation

플립칩용 에폭시 접착제의 저온 속경화 거동에 미치는 경화제의 영향

Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding

최원정^{1, 2}, 유세훈¹, 이효수¹, 김목순², 김준기^{1, †}

¹한국생산기술연구원 용접접합기술센터/마이크로조이닝센터
²인하대학교 금속공학과

Won-Jung Choi^{1, 2}, Se-Hoon Yoo¹, Hyo-Soo Lee¹, Mok-Soon Kim², and Jun-Ki Kim^{2, †}

¹Welding & Joining Technology Center, KITECH, Incheon, Korea, Korea
²School of Materials Science & Engineering, Inha University, Incheon, Korea

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Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160oC was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

Keywords:flip chip bonding;epoxy adhesive;NCP(non-conductive paste);snap cure

[References]

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Rieger J, Polymer Test., 20, 199 (2001)
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Kim MS, Kim HY, Yoo SH, Kim JH, Kim JK, J. Kor. Welding Soc., 29(4), 54 (2011)

[1] Teh LK, Anto E, Wong CC, Mhaisalkar SG, Wong EH, Teo PS, Chen Z, Thin Solid Films, 462-463, 446 (2004)

[2] Ho PS, Wang G, Ding M, Zhao JH, Dai X, Microelectron. Reliab., 44, 719 (2004)

[3] Lu D, Wong CP, Materials for Advanced Packaging, p.719, Springer, NY, USA. (2008)

[4] Min KE, Lee JS, Yoo S, Kim MS, Kim JK, Korean J. Mater. Res., 20(12), 681 (2010)

[5] Lee SJ, Yoo SH, Lee CW, Lee JH, Kim JK, J. Microelectron. Packag. Soc., 16(3), 25 (2009)

[6] Petrie EM, Epoxy Adhesive Formulations, p.99, McGraw-Hill, USA. (2006)

[7] Rieger J, Polymer Test., 20, 199 (2001)

[8] Ogura I, Electronics Application of Epoxy resin, p.23, Information Technology Association, Japan (2005) (in Japanese). (2005)

[9] Kim MS, Kim HY, Yoo SH, Kim JH, Kim JK, J. Kor. Welding Soc., 29(4), 54 (2011)