화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Polymer(Korea), Vol.38, No.6, 752-759, November, 2014
Export Citation
개환 복분해 중합을 통한 가교형 폴리이미드 박막의 잔류응력 거동 및 특성 분석
Residual Stress Behavior and Characterization of Polyimide Cross-linked Networks via Ring-opening Metathesis Polymerization
남기호, 서종철1, 장원봉2, 한학수†
  • 연세대학교 공과대학 화공생명공학과
  • 1연세대학교 과학기술대학 패키징학과
  • 2엘지디스플레이(주)
Ki-Ho Nam, Jongchul Seo1, Wonbong Jang2, and Haksoo Han†
  • Department of Chemical and Biomolecular Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 120-749, Korea
  • 1Department of Packaging, Yonsei University, 1 Yonseidae-gil, Wonju, Gangwon-do 220-710, Korea
  • 2Department of R&D, LG Display, 1007 Deogeun-ri, Wollong-myeon, Paju-si, Gyeonggi-do 413-811, Korea
E-mail:
초록
본 연구에서는 미세 전자 소자용 절연박막 및 차세대 플렉시블 디스플레이 기판으로서 사용이 기대되는 폴리이미드(PI)에 개환 복분해 중합(ring-opening metathesis polymerization)이 가능한 환형 말단 캡핑제(end-capping agent)인 cis-1,2,3,6-tetrahydrophthalic anhydride(CDBA)로 사슬 말단에 가교 반응이 된 가교형 폴리이미드를 합성하였다. 말단 캡핑제의 조성비에 따른 가교형 폴리이미드 박막의 잔류응력 거동은 thin film stress analyzer(TFSA)를 이용한 wafer bending mothod로 온도에 따라 연속적인 거동을 in-situ로 측정하였다. 열특성은 시차 주사 열량계(DSC), 열기계 분석기(TMA) 및 열 중량 분석기(TGA)를 이용하여 측정하였고, 광학 특성은 자외선/가시광선 분광광도계(UV-vis)와 색차계(spectrophotometer)를 이용하였으며, 네트워크 구조의 모폴로지(morphology) 변화를 통해 해석하였다. 말단 캡핑제의 조성비가 증가함에 따라 잔류응력은 27.9에서 -1.3 MPa로 초저응력 및 향상된 열 특성을 나타내었으나, 광학 특성은 감소됨을 보였다. 가교형 폴리이미드 박막의 우수한 특성 발현은 고집적도 다층 구조의 안정성 및 신뢰도가 요구되는 분야의 응용성이 확대될 것으로 기대된다.
Cross-linked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the cross-linked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of cross-linked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the cross-linked PI makes them potential candidates for versatile high-density multi-layer structure applications.
Keywords:polyimide;ring-opening metathesis polymerization;cross-linked network;residual stress behavior;morphology.
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