To maximize the conversion efficiency of solar cells by improving the trapping of incident light, surface texturing of multicrystalline silicon wafers is a more permanent and effective solution to decrease reflections compared with antireflection coatings. In general, many techniques of wet chemical surface texturing depend on crystal orientation. Also, these processes place a limitation on the growth of solar production capacity due to consumption of the large amount of material, de-ionized water and chemicals. Reactive ion etching (RIE) is therefore useful for mc-Si solar cells with the random grain orientation. In this study, we have fabricated mc-Si solar cells with a large-area (156 mm x 156 mm) by a random RIE texturing method using SF6/O-2 plasma chemistry. A large amount of silicon loss, which is due to saw damage removal and texturing process of mc-Si wafers, have dramatically decreased by applying RIE texturing process. As a result of the optimum RIE process, the best mc-Si solar cell showed conversion efficiency, fill factor, short circuit current density, and open circuit voltages as high as 17.4%, 80%, 35 mA/cm(2) and 620 mV, respectively. This study demonstrates that it is possible to apply the thin mc-Si Solar cells fabrication for low cost and high efficiency in conventional industrial production line. (C) 2013 Elsevier B.V. All rights reserved.