We report prediction of selected physical properties (e.g. glass transition temperature, moduli and thermal degradation temperature) using molecular dynamics simulations for a difunctional epoxy monomer (the diglycidyl ether of bisphenol A) when cured with p-3,3'-dimethylcyclohexylamine to form a dielectric polymer suitable for microelectronic applications. Plots of density versus temperature show decreases in density within the same temperature range as experimental values for the thermal degradation and other thermal events determined using e.g. dynamic mechanical thermal analysis. Empirical characterisation data for a commercial example of the same polymer are presented to validate the network constructed. Extremely close agreement with empirical data is obtained: the simulated value for the glass transition temperature for the 60 degrees C cured epoxy resin (simulated conversion alpha = 0.70; experimentally determined alpha = 0.67 using Raman spectroscopy) is ca. 70-85 degrees C, in line with the experimental temperature range of 60-105 degrees C (peak maximum 85 degrees C). The simulation is also able to mimic the change in processing temperature: the simulated value for the glass transition temperature for the 130 degrees C cured epoxy resin (simulated alpha = 0.81; experimentally determined alpha = 0.73 using Raman and alpha = 0.85 using DSC) is ca. 105-130 degrees C, in line with the experimental temperature range of 110-155 degrees C (peak maximum 128 degrees C). This offers the possibility of optimising the processing parameters in silico to achieve the best final properties, reducing labour- and material-intensive empirical testing. (C) 2013 Elsevier Ltd. All rights reserved.