A study on the impact of batch-to-batch variability of a commercial wet adhesive on its plastic deformation behaviour is here presented. In the chip-apply process, a controlled and stable plastic deformation under thermal-mechanical compression is expected after the first of a two-step curing, named pre-cure. Wet adhesive batches rheological, mechanical and chemical characteristics are available but no information on deformation behaviour is provided. Different pre-curing recipes and oven atmospheres were tested and the plastic deformation was induced by applying pre-defined thermo-compression parameters. Results indicate that shorter pre-cure cycles at higher temperature, under air atmosphere, reduce batch-to-batch deformation variability. DSC curves support these findings. A correlation between deformation level and rheological properties could also be observed, which can be very useful in the triage of adhesive batches for specific process parameters window.