Materials Science Forum, Vol.483, 853-856, 2005
High power lateral epitaxy MESFET technology in silicon carbide
High impedance silicon carbide power RF transistors are reported, which use the technology of Lateral Epitaxy Metal-Semiconductor FET (LEMES). The LEMES transistor utilizes a heavily doped buried depletion stopper to increase output impedance and breakdown voltage and to eliminate undesirable hot-carrier trapping effects. A power density of 2-3 W/mm at 2 GHz is routinely achieved resulting in a total output power of IOW for packaged components. The of input and output impedance is around 50 Ohms for a frequency of around 2 GHz.