We report the successful bonding of microstructured Silicon carbide using the reaction between polymer layer and sputtered silicon thin film. The necessary steps and the process parameters have been optimized. The bonded substrates have been analyzed using optical microscope, SEM/EDX and ESCA. The substrates were also tested for their bond strength. It has been found that optimum combination of silicon film thickness and polymer layer in sandwich configuration is necessary for achieving better bond strength.