This paper presents the design and fabrication of integrated micromachined inductors on silicon substrates. In order to reduce eddy currents in silicon substrates, bulk-micromachining technology is used to etch the silicon wafer. In this way, aluminum spiral micromachined inductors can achieve a quality factor Q of approximately 30 (0.6-2 nH @ 2-15 GHz). Also, the resistivity of the inductors material is discussed.