A new ohmic contact composition Au/Pd/Ti/Pd is proposed and studied in comparison with Au/Pd contacts. A reproducible low contact resistivity of 2.89 x 10(-5) Omega.cm(2) have been obtained after annealing at 900 degreesC. The Au/Pd/Ti/Pd contacts showed excellent thermal stability during long-term ageing at 500 degreesC and 600 degreesC. The surface morphology has been studied in respect of the contact composition and annealing conditions. The results showed that the addition of Ti into the contact composition improves the surface morphology as well as the thermal stability.