Ceramic-metal composite materials (CMC) are a new technology based on present and future applications with a wide range of possible material combinations. CMC materials combine the positive features of ceramics with the toughness and ductility of metallic phases. The development of these materials will extend the application field of structural ceramics up to work temperatures limited by the melting point of the metallic phase. The main step to define compatibility between CMC materials is to determine their physical and chemical interaction mechanisms. The main aim of this work is to evaluate the silicon carbide - copper based alloy system for developing CMC materials. The contact angle between Cu and SiC at 1100degreesC is 140 and the bonding is weak; furthermore, investigations have shown that wettability is improved with Ti additions. Two Cu based alloys containing 3 and S wt% of Ti were used in this work. Wettability was evaluated by the sessile drop method in a vacuum and argon atmosphere at a test temperature of 1200degreesC. The specimens obtained were subsequently characterised by Scanning Electron Microscopy, EDX, DRX and DTA Analysis in order to study the type of interface developed after such treatment. The most important results are related to the differences between atmospheres and Ti diffusion.