Cured thermosetting polymers are widely used as under-fill material in the microelectronic industry. Significant volume shrinkage occurs. during the curing of this kind of resins, and hence residual stresses are introduced into the products. In previous shrinkage measurements on curing resins under DMA tests the thickness change of a coin shaped specimen was measured and subsequently the volumetric shrinkage was calculated by assuming that no lateral deformation occurs. However, to obtain more accurate investigation the deformed shape of the borders of the specimen must be performed. An image. processing technique was developed in the laboratory to measure boundary deformation of specimens under DMA tests. The lateral shrinkage and the thickness change are measured in the image field by area measurement and by edge tracking, respectively. Delamination is a widely existed failure mode in multi-layer structures, including micro-electronic components. This failure mode may play an important/fatal role to lead to the final failure of an electronic structure or to threat reliability of an electronic component. Three-point bending test on (0,90,0) laminate was performed for calculation of inter-laminar shear strength and deformation field was also measured on the side of specimen. The applied image processing technique is based upon the so-called cross-correlation method and it was used to evaluate the deformation field using the surface texture as market for tracking translation over the observed area.