The crystallographic texture in damascene copper interconnect line-widths varying from 0.35 to 100 microns has been investigated. Field Emission Gun- SEM orientation imaging microscopy was used in the investigation. The inverse pole figure maps, (111) pole figure and orientation distribution functions (ODF) for all the line-widths have been plotted. Various texture components were found to exist in the lines, the more common being (111). The presence of (511) and (5 7 13) components, which are the first and second-generation twins of (111) component, was also observed. (110) component was present in some lines. The presence of (001) component and its first generation twin (221) was also observed. In the case of 0.4 and 0.5 mum lines the (111) fiber component developed from the sidewalls. The area fraction of the grains with (111) direction normal to the specimen surface has been plotted for all the line-widths. There is an increase of this area fraction for lines with decreasing widths in the sub-micron range and with increasing widths greater than I micron.