The transitional metal nitrides, TiN, TaN and W2N, are widely used as coating materials due to their good mechanical and conductivity properties, high thermal properties, strong erosion and corrosion resistance and as diffusion barriers because of low diffusion rates of aluminum and copper through them. TiN, TaN and W2N thin films can be deposited by various physical and chemical vapor deposition processes. Depending on the process used, the texture and microstructure of the these films will be varied. Knowledge of the texture and microstructure of TiN, TaN and W2N thin films is very important in order to be able to understand their physical, mechanical and electrical properties. Despite a lot of studies on the mechanism of texture evolution of TiN, TaN and W2N thin films, researchers could not well explain the relation between the texture evolution and the deposition parameters until recently. In this paper, we review the mechanism of texture evolution in TiN, TaN and W2N thin films depending on the deposition parameters. The preferred growth model [1-3] for the texture evolution can explain the deposition textures of TiN, TaN and W2N thin films reported in many studies.