화학공학소재연구정보센터
Materials Science Forum, Vol.408-4, 895-900, 2002
Recrystallization texture of a copper electrodeposit with the < 111 > and < 110 > duplex orientation
The copper electrodeposits with the <110> and <111> orientations undergo texture transitions to and <100> orientations, respectively, after recrystallization. However, a weakly developed <110> and <111> duplex deposition texture changes to the recrystallization texture. The result has been discussed based on the recrystallization rate and tensile strength data of the deposits with the <110> and <111> orientations obtained under similar electrolysis conditions.