Effect of Surface Modification of Fillers on the Properties of IC Encapsulation Compounds

Ko M; Kim M

Korea Polymer Journal, Vol.5, No.3, 160-165, September, 1997

The effect of the surface modification of silica fillers on the properties of IC encapsulation compounds was studied. It was found that the effect on the mechanical strength was clearly appeared at high temperature and after moisture uptake. The mechanical strength increased by increasing the content of coupling agents. However excess amount of coupling agents degraded the strength of encapsulating compounds. The surface treatment of fillers with coupling agents could either increase or decrease the flowability of encapsulating compound, depending on the content and species of agents used. In case of the epoxy silane, the spiral flow was increased by adding the large amount of the agent, while the amino silane degraded the flowability. The surface treatment of fillers also showed a greater effect on the workability of the encapsulation compound including flash/bleed and pot life. Excess usage of the agents could increase the flash/bleed length and accelerate the curing reaction even at room temperature resulting in the deterioration of compound''s pot life. C-SAM results showed the effect of coupling agents on the adhesion of molding compounds to leadframe metal substrate. Amino silane had a better adhesion strength than epoxy silane.

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