Journal of Crystal Growth, Vol.401, 740-747, 2014
Three-dimensional phase field modeling of silicon thin-film growth during directional solidification: Facet formation and grain competition
Adaptive phase field modeling is applied to simulate a directional solidification for silicon in three dimensions. Several parameters are considered for the highly anisotropic interfacial energy and kinetic coefficient of silicon. The morphological evolution and the thermal field near the interface are presented and compared with experiments. The mechanisms for facet formation and grain competition are further discussed. (C) 2014 Elsevier B.V. All rights reserved,