Electroless nickel-high-phosphorus Ni-P plating is known for its physical properties. In case of electronic and mechatronic assembly processes achieved under ambient conditions the wettability of the Ni-P layer under ambient temperature and ambient air stays a point of surface quality investigation. This contribution will be devoted to the study of the surface properties of Ni-P films for which we performed air plasma treatment. We focus our attention on the evolution of the surface wettability, using the classical sessile drop technique. Interpreting the results with the OWRK model we extract the polar and disperse surface tension components from which we deduced typical evolution of the surface properties with the different treatment settings. By controlling the variations of the parameters of the plasma exposure we are able to change the responses of our Ni-P sample from total hydrophobic to total hydrophilic behaviours. All the intermediate states can be reached by adapting the treatment parameters. So it is demonstrated that the apparent Ni-P surface properties can be fully adapted and the surface setting can be well characterized by wettability measurements. To deep our knowledge of the surface modifications induced by plasma we performed parallel SEM and XPS analyses which provide informations on the structure and the chemical composition of the surface for each set of treatment parameters. Using this double approach we were able to propose a correlation between the evolution of surface chemical composition and surface wettability which are completely governed by the plasma treatment conditions. Chemical parameters as the elimination of the carbon contamination, the progressive surface oxidation, and the slight incorporation of nitrogen due to the air plasma interaction are well associated with the evolution of the wettability properties. So a complete engineering for the Ni-P surface preparation has been established. The sessile drop method can be considered as a very efficient method to propose qualification of treatments onto Ni-P surfaces before performing electronic and mechatronic assembly processes that are achieved under ambient conditions. (C) 2013 Elsevier B.V. All rights reserved.