Interconnect technology of carbon nanotubes (CNTs) is essential for functional devices. However, difficulty in the fabrication of the interface between carbon nanotube (CNT) and CNT in axial direction, hindered the quality of connection and practical applications of electrical devices. Also, investigation of dynamic evolution of connection configuration about nanowelding is still lacking. In order to analyze the nanowelding configuration between CNTs in axial direction, the different connection cases are investigated using molecular dynamics simulation. Simulation results show that the nanowelding process could be accomplished at a lower temperature than the melting point of the bulk solder and the CNTs are connected with solder joints of nodule shape. It is also found that metal atoms are captured and dragged into nanotube to form the core filling structures of nanowires during nanowelding. Also, the connection configuration shows that Ag atoms diffuse along the outer walls of SWNTs with the dominant mechanism of capillary wetting, which would increase the contact length to improve the mechanical strength. (C) 2012 Elsevier B. V. All rights reserved.