화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Korea-Australia Rheology Journal, Vol.26, No.1, 39-48, February, 2014
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Toward residual-layer-free nanoimprint lithography in large-area fabrication
Hyunsik Yoon†, Hyemin Lee, and Won Bo Lee1, †
  • Department of Chemical & Biomolecular Engineering, Seoul National University of Science & Technology, Seoul 139-743, Republic of Korea
  • 1Department of Chemical and Biomolecular Engineering, Sogang University, 1 Sinsu-dong, Mapo-gu, Seoul 121-732, Republic of Korea
E-mail:,
In the paper, residual-layer-free nanoimprint lithography for large-area fabrication is reviewed. In order to remove the residual layer during the imprint process, polymer resists and mold materials should be designed with the aspects of surface chemistry and mold geometries in mind. Various approaches for residual-layerfree nanoimprint lithography are discussed including incomplete filling by polymer mass, reverse imprint methods, self-removal techniques, and the employment of elastomeric mold deformation. In addition, issues that must be overcome to enable large-area roll-to-roll nanoimprinting without a residual layer are presented.
Keywords:nanoimprint;residual layer;polymer;mold;roll-to-roll process
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