In this work we analyze the influence of process parameters on the morphology of highly porous platinum electrodes, fabricated by co-deposition of platinum-copper alloy and subsequent selective dissolution, of the less noble copper during multiple cyclic voltammetry scans. Thereto the Cu2+ concentration in the deposition electrolyte, the negative scan limit, and the scan rate were varied. Corresponding electrodes were characterized by their surface texture (scanning electron microscopy, X-ray diffractometry), specific surface area, and elemental compositions (X-ray photoelectron spectroscopy and energy dispersive X-ray spectroscopy). Under conditions enforcing precursor depletion a sphere-dominated structure is observed, whereas oppositional configurations lead to smoother, mud-crack pattern like structures. Electrodes of high specific surface area are obtained particularly when high copper ion concentrations (100 mmol l(-1), CuSO4, roughness factor 3740 +/- 270), high negative scan limits (-0.800 V vs. SCE, roughness factor 3790 +/- 370) and low scan speeds (1 mV s(-1), roughness factor 3930 +/- 370) compared to standard parameters (20 mmol l(-1) CuSO4, -0.600 V vs. SCE negative scan limit, 1 mV s(-1), roughness factor 3040 +/- 300) were applied during fabrication. Since the fabrication of these highly rough electrodes requires the deposition of high amounts of platinum (10-20 mg per cm(2) footprint area) it is mainly relevant to applications such as neurostimulation electrodes or implantable glucose fuel cells in which platinum costs are less relevant than electrode properties and functionality. (C) 2013 The Electrochemical Society. [DOI: 10.1149/2.001304jes] All rights reserved.