비닐에스테르 수지의 구조 및 분자량이 물질에 미치는 영향

홍석표; 최상구; 유길상

Journal of the Korean Industrial and Engineering Chemistry, Vol.3, No.2, 318-326, June, 1992

Export Citation

비닐에스테르 수지의 구조 및 분자량이 물질에 미치는 영향

Influence of Molecular Weight and Structure on the Physical Properties of the Vinylester Resin

홍석표, 최상구, 유길상

초록

분자량 350∼360을 가진 비스페놀형 에폭시 수지(DER 331)를 전체 에폭시 성분 중 50% 이내의 범위에서 분자량 1,000∼1,600을 가진 비스페놀형 에폭시수지(DER 662, 664) 및 분자량 800∼1,000을 가진 노블락형 에폭시수지(DEN 439)와 혼합 사용하여 합성한 비닐에스테르수지의 액상 및 경화물성을 연구하였다. 희석점도는 분자량과 용해성의 영향을 받았으며 저분자량의 함량이 늘어날수록 낮아졌다. 경화시간은 MAA의 양에 영향을 받았으며 저분자량의 함량이 늘어날수록 비스페놀형은 빨라졌고 노블락형은 변화를 보이지 않았다. 경도와 신율은 분자구조의 영향을 받았으며 저분자량의 함량이 늘어날수록 떨어졌다. 굴곡강도와 인장강도는 DER 331 함량 30∼40%에서 가장 우수했다.

Vinylester resin was synthesized by reacting epoxy resin with MAA(methacrylic acid) at a equivalent ratio of 1.1/1.0 in the presence of N,N dimethyl benzylamine. Low molecular weight epoxy(DER 331) was used together with higher molecular weight epoxy(DER 662, DER 664) and a novolac epoxy(DEN 439), and the amount of DER 331 was not over 50% of the total epoxy components. Viscosity, cure time and mechanical properties of the vinylester resin were profoundly influenced by the quantity of reacted MAA, and the structure and molecular weight of the epoxy resin. Tensile and flexural strength appeared to be the greatest when DER 331 fraction was 30∼40%.

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[1] Dow Chemical Co., "Technical Bull.," (1987)

[2] U.S. Patent, 3,301,743 (1976)

[3] U.S. Patent, 3,594,247 (1971)

[4] Leblainvaux F, Madec PJ, Polym. Bull., 13, 237 (1985)

[5] Rao BS, Madec PJ, Polym. Bull., 16, 153 (1986)

[6] Japan Patent, 15-988 (1970)

[7] Barker NG, Cromwell NH, J. Am. Chem. Soc., 73, 1051 (1951)

[8] U.S. Patent, 3,676,524 (1972)

[9] Leon S, John W, Ind. Eng. Chem., 48, 86 (1956)

[10] Linow WH, Bearden CR, "21st SPI Reinforced Plastics/Composites Conference," Paper 1-D (1966)

[11] Varma IK, Angew. Makromol. Chem., 130, 191 (1985)

[12] Yoshino M, Shibata M, J. Paint Tech., 44, 116 (1972)

[13] U.S. Patent, 3,634,542 (1971)

[14] U.S. Patent, 3,773,856 (1979)

[15] U.S. Patent, 4,129,609 (1978)

[16] U.S. Patent, 4,151,209 (1979)

[17] Alessi P, Kikic I, Papo A, J. Coat. Technol., 51, 62 (1979)

[18] Burrel H, "Solubility Parameter Values, in Polymer Handbook, J. Brandrup and E.H. Immergut," Wiley Interscience, New York, 341 (1966)

[19] Encyclopedia of Polymer Science and Tech., Wiley Interscience, Vol. 7, 644 (1968)

[20] Grulke EA, "Solubility Parameter Value, in Polymer Handbook, J. Brandrup and E.H. Immergut," Wiley Interscience, New York, 3rd, 519 (1989)

[21] Zin WC, Polym.(Korea), 12(7), 605 (1988)

[22] Kelly PB, Landua AJ, Marshall CD, J. Appl. Polym. Sci., 6, 425 (1962)

[23] Tanaka Y, Mika TF, "Epoxy Resin," Dekker, New York, 106 (1973)

[24] Breenly RZ, "Free Radical Copolymerizations of Vinyl Monomer, Polymer Handbook, 3rd," Interscience Pub., John Wiley, New York, 267 (1989)

[25] Theocaris PS, Paipethis SA, J. Appl. Polym. Sci., 22, 1417 (1978)

[26] Holliday L, "Composite Materials," Elsevier, Amsterdam, Chap. 1 (1966)

[27] Casassa EZ, J. Macromol. Sci.-Chem., A15, 787 (1981)

[28] Gardon JL, "Treaties on Adhersion and Adhesives," Vol. 1, Dekker, New York, 314 (1967)

[29] Tobolsky AV, "Properties and Structure of Polymers," Wiley, New York (1960)

[30] Seoul Miwon Co., "Unsaturated Polyester Tech. Bull," (1990)

[31] Theocaris PS, Polymer, 20, 1149 (1979)

[32] Ferry JD, "Viscoelastic Properties of Polymers, 2nd Edn," Wiley, New York (1970)

[33] Chermant JL, Coster M, J. Mater. Sci., 14, 509 (1979)