Aramid단 섬유보강 고기능폴리에틸렌 및 에폭시 복합재료 제조-I.DSC에 의한 에폭시/아민계의 경화 촉진 연구

하창식; 임승하; 김병규; 신영조; 조원제

Journal of the Korean Industrial and Engineering Chemistry, Vol.3, No.1, 111-118, March, 1992

Short Aramid Fiber Reinforced Polyethylene and Epoxy Composity-I. Studies on the Curing Acceleration of Epoxy/Amine System by Differential Scanning Calorimeter

하창식, 임승하, 김병규, 신영조, 조원제

초록

시차주사열량계(DSC)를 이용하여 에폭시 -아민계의 경화 촉진을 연구하였다. 비스페놀 A의 디글리시딜에테르(DGEBA)든 촉진제와 함께 또는 촉진제 없이 메틸렌디아닐린(MDA)으로 경화시켰다. 본 연구를 위하여 트리스(디메틸아미노메틸페놀(DMP -30)과 3- (3,4- 디클로로페닐) - 1,1 - 디메틸우레아(DIU-ON) 두 종류의 촉진제를 사용하였는데 경화시의 발열량, 유리전이온도(T_g) 및 동적 DSC에 의한 활성화에너지 계산에 의해 DMP -30이 빠른 경화 속도 및 낮은 활성화에너지를 보여 DIURON보다 양호한 촉진제임을 알 수 있었다.

The curing acceleration of epoxy/amine system was investigated by using differential scanning calorimeter(DSC), The epoxy, diglycidylether of bisphenol A (DGEBA) was cured with methylene dianiline (MDA) with or without accelerators. Two kinds of accelerators were tested for the study ; tris(dimethylaminomethyl)phenol (DMP -30) and 3-(3,4-dichlorophenyl)-1, 1-dimethylurea (DIURON). Heats of reaction and glass transition temperatures (T_g of the cured epoxy system were analyzed by DSC along with the estimation of activation energy by the dynamic DSC studies. It was found that DMP -30 is more effective accelerator than DIURON which showed faster curing and lower activation energy.

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[1] May CA, "Epoxy Resins - Chemistry and Technology," 2nd ed., Marcel Dekker Inc., New York, Chap. 1 (1988)

[2] Lim SH, Ha CS, Cho WJ, Proc. PPS Int'l, Meeting on Rheology and Polymer Processing, Sept. 27-29, Seoul, pp. 199-201 (1990)

[3] Shim JS, Lee W, Jang JS, Proc. Polymer Soc. of Korea '90 Annual Fall Meeting, pp. 86-87 (1990)

[4] Dusek K, Polymer, 19, 931 (1978)

[5] Richardi CC, Adabbo HE, Williams RJ, J. Appl. Polym. Sci., 29, 2481 (1984)

[6] Shim JS, Lee W, Jang JS, Polym. Bull., 25(6), 557 (1991)

[7] Shim JS, Lee W, Jang JS, Polym. Bull., 25(6), 661 (1991)

[8] Shim JS, Lee W, Jang JS, Polym. Bull., 25(6), 669 (1991)

[9] May CA, "Epoxy Resins - Chemistry and technology," 2nd ed., Marcel Dekker Inc., New York, p. 505, p. 1093 (1988)

[10] Ha CS, Lim SH, Kim DH, Cho WJ, J. Korean Soc. Comp. Mat., 4(1), 70 (1991)

[11] Galy J, Sabra A, Pascault JP, Polym. Eng. Sci., 26(21), 1554 (1986)

[12] Tajima Y, Crozier DG, Polym. Eng. Sci., 26(21) (1986)

[13] Horie K, Sawada M, J. Polym. Sci., 29, 2481 (1984)

[14] Fava RA, Polymer, 9, 137 (1968)

[15] Ha CS, "Properties of Dynamically Cured EPDM and PP/HDPE Blends," Ph.D. Dissertation, KAIST, Seoul, Append (1987)

[16] Fedtke M, "Initiation and Acceleration Mechanisms in Epoxy Resin Curing Reactions Involving Model Reactions," in T. Saegusa, T. Higashimura and A. Abe, eds., "Frontiers of Macromolecular Science," Blackwell Scientific Publ., London, p. 149 (1988)

[17] Wiggins PL, "Curing Acceleration of a Hindered Aromatic Diamine - Epoxy Systems,," Proc. of 41st. Ann. Conf. Reinf. Plast/Comp, Soc. Plast, Ind. Jan. 27-31, Session 5-A, p. 1 (1986)

[18] Kissinger HE, Anal. Chem., 29, 1702 (1957)

[19] Lee SN, Yuo WB, Polym. Eng. Sci., 26(21), 1317 (1986)

[20] Enns JB, Gillham JK, J. Appl. Polym. Sci., 28, 2831 (1983)

[21] Lim SH, Ha CS, Cho WJ, Polym.(Korea), in press (1992)