Selection of thinner for epoxy type resins for neon transformer housing

In-Kwon Hong; Yong Soo Yoon; Seung-Bum Lee

Journal of Industrial and Engineering Chemistry, Vol.18, No.6, 1997-2003, November, 2012

DOI10.1016/j.jiec.2012.05.018 Export Citation

Selection of thinner for epoxy type resins for neon transformer housing

In-Kwon Hong , Yong Soo Yoon , and Seung-Bum Lee^†

Department of Chemical Engineering, Dankook University, 448-701, Republic of Korea

E-mail:

Epoxy type resin is used for neon transformer housing, and the choice of thinner used to improve the workability of the epoxy that does not degrade its thermal stability is very important. In this study, the fluidity of epoxy type resin and the thermal stability of curing materials were evaluated by varying the amount of the thinner used. The fluidity of the epoxy type resin was improved by the following thinners at a temperature of 303 K in ascending order of performance: nonyl phenol < di-n-butyl phthalate < aliphatic glycidyl ether, phenyl glycidyl ether < styrene oxides < benzyl alcohol < o-xylene, butyl glycidyl ether. The thinners in order of ascending thermal stability at a surrounding temperature of 453 K: o-xylene < benzyl alcohol < phenyl glycidyl ether < butyl glycidyl ether < styrene oxides < nonyl phenol < di-n-butyl phthalate, aliphatic glycidyl ether. Therefore, aliphatic glycidyl ether and di-n-butyl phthalate were selected as the optimum thinners for neon transformer housings, and the amount of thinner used for each was 10 wt%.

Keywords:Epoxy type resin;Neon transformer housing;Thinner;Viscosity;Thermal stability

[References]

Karak K, Journal of Polymer Materials., 23, 1 (2006)
Hunston DL, Journal of Elastomers and Plastics., 12, 133 (1980)
Chen M, Ren AS, Wang JF, Lee MS, Dalton LR, Zang H, Sun G, Steirer WH, Polymer Preparation., 40, 162 (1999)
Goulding TM, Pizzi A, Mattal KL, Handbook of Adhesive Technology, Marcel Dekker, NY (1994)
Lewis AF, in: May CA (Ed.), Epoxy Resins, Chemistry and Technology, Marcel Dekker, NY, 653 (1988)
Schmidt RG, Bell JP, Advances in Polymer Science, vol. 75, Springer-Verlag, Berlin, 33 (1986)
Bauer RS, Epoxy Resin Chemistry I, American Chemical Society, Washington, DC (1979)
Bauer RS, Epoxy Resin Chemistry II, American Chemical Society, Washington, DC (1983)
Lubin G, Handbook of Composite, Van Nostrand Reinhold Company, NY (1984)
Martino RR, SPE Journal, ibid. (1965)
Stenzenberger HD, Romer W, 34th, May 8.11, 899 (1989)
Iijima T, Miura S, Fukuda W, Tomoi M, European Polymer Journal., 29, 1399 (1993)
Vaskil UM, Martin GC, Journal of Applied Polymer Science., 46, 2089 (1992)
Frigione ME, Mascia L, Acierno D, European Polymer Journal., 31, 1021 (1995)
Thakkar J, RPatel RD, Patel RG, Patel VS, British Polymer Journal., 22, 143 (1990)
Mustata F, Bicuy I, Cascaval CN, Journal of Polymer Engineering., 17, 491 (1997)
Jagadeesh KS, Rao JG, Shashikiran K, Suvarna S, Ambekar SY, Saletore M, Biswas C, Rajanna AV, J. Appl. Polym. Sci., 77(10), 2097 (2000)
Mika TF, Bauer RS, in: May CA (Ed.), Epoxy Resins, Chemistry and Technology, Marcel Dekker, NY, (Chapter 4)., 465 (1988)
Patel RD, Patel RG, Patel VS, British Polymer Journal., 19, 37 (1987)
Urbaczewski E, Pascault JP, Sautereau H, Riccardi C, Moschiar S, Williams RJJ, Macromolecular Chemistry., 191, 943 (1990)
Urbaczewski-Espuche E, Galy J, Gerard JF, Pascault JP, Sautereau H, Polymer Engineering and Science., 31, 1572 (1991)
Pocius AV, Schultz WJ, Adam RE, in: Proceedings of the Adhesion Society, Hilton Head (1986)
Manzione LT, Gillham JK, Journal of Applied Polymer Science., 26, 889 (1981)
Lee SB, Hong IK, J. Ind. Eng. Chem., 17(3), 404 (2011)
Lee SB, Lee HJ, Hong IK, J. Ind. Eng. Chem., 18(2), 635 (2012)

[Referenced By]

[Related Articles]

[1] Karak K, Journal of Polymer Materials., 23, 1 (2006)

[2] Hunston DL, Journal of Elastomers and Plastics., 12, 133 (1980)

[3] Chen M, Ren AS, Wang JF, Lee MS, Dalton LR, Zang H, Sun G, Steirer WH, Polymer Preparation., 40, 162 (1999)

[4] Goulding TM, Pizzi A, Mattal KL, Handbook of Adhesive Technology, Marcel Dekker, NY (1994)

[5] Lewis AF, in: May CA (Ed.), Epoxy Resins, Chemistry and Technology, Marcel Dekker, NY, 653 (1988)

[6] Schmidt RG, Bell JP, Advances in Polymer Science, vol. 75, Springer-Verlag, Berlin, 33 (1986)

[7] Bauer RS, Epoxy Resin Chemistry I, American Chemical Society, Washington, DC (1979)

[8] Bauer RS, Epoxy Resin Chemistry II, American Chemical Society, Washington, DC (1983)

[9] Lubin G, Handbook of Composite, Van Nostrand Reinhold Company, NY (1984)

[10] Martino RR, SPE Journal, ibid. (1965)

[11] Stenzenberger HD, Romer W, 34th, May 8.11, 899 (1989)

[12] Iijima T, Miura S, Fukuda W, Tomoi M, European Polymer Journal., 29, 1399 (1993)

[13] Vaskil UM, Martin GC, Journal of Applied Polymer Science., 46, 2089 (1992)

[14] Frigione ME, Mascia L, Acierno D, European Polymer Journal., 31, 1021 (1995)

[15] Thakkar J, RPatel RD, Patel RG, Patel VS, British Polymer Journal., 22, 143 (1990)

[16] Mustata F, Bicuy I, Cascaval CN, Journal of Polymer Engineering., 17, 491 (1997)

[17] Jagadeesh KS, Rao JG, Shashikiran K, Suvarna S, Ambekar SY, Saletore M, Biswas C, Rajanna AV, J. Appl. Polym. Sci., 77(10), 2097 (2000)

[18] Mika TF, Bauer RS, in: May CA (Ed.), Epoxy Resins, Chemistry and Technology, Marcel Dekker, NY, (Chapter 4)., 465 (1988)

[19] Patel RD, Patel RG, Patel VS, British Polymer Journal., 19, 37 (1987)

[20] Urbaczewski E, Pascault JP, Sautereau H, Riccardi C, Moschiar S, Williams RJJ, Macromolecular Chemistry., 191, 943 (1990)

[21] Urbaczewski-Espuche E, Galy J, Gerard JF, Pascault JP, Sautereau H, Polymer Engineering and Science., 31, 1572 (1991)

[22] Pocius AV, Schultz WJ, Adam RE, in: Proceedings of the Adhesion Society, Hilton Head (1986)

[23] Manzione LT, Gillham JK, Journal of Applied Polymer Science., 26, 889 (1981)

[24] Lee SB, Hong IK, J. Ind. Eng. Chem., 17(3), 404 (2011)

[25] Lee SB, Lee HJ, Hong IK, J. Ind. Eng. Chem., 18(2), 635 (2012)