We demonstrate catalyst-free electroless deposition of copper on a poly(4-vynylpyrridine)-grafted-poly (tetrafluoroethylene) surface. The principle of this process relies on deposition of an organo-copper(II) precursor film on the functionalized polymer surface and on subsequent plasma-assisted reduction of the copper ion to form nanoparticles. A polymer surface densely and homogeneously seeded with copper nanoparticles enable to initiate autocatalytic electroless deposition of copper layer without need for any prior sensitizing the surface with conventionally used SnCl(2) and Pd species. Crown Copyright (C) 2009 Published by Elsevier B.V. All rights reserved.