Thermomechanical analysis is Presented to study the basic temperature effects on elastomeric substrate of flexible electronics. Strains of a films-on-substrate structure related with three key temperatures are given based on the interfacial continuum model. An improved strain model is given and compared with other two models. The role of the temperature-dependent effects is highlighted and adopted to design a flexible inorganic/organic heterogeneous structure subject to little thermal action. The sensitivity analysis of three key temperatures is investigated, by which proper selection of technological parameter for poly (dimethylsiloxane) fabrication may be determined to eliminate the variation of stress of the interface in circumstances with temperature varying severely. This work contributes to systemic reliability and compatibility, structural design and thermal management of flexible electronics. (C) 2009 Elsevier B.V. All rights reserved.