Thin Solid Films, Vol.518, No.5, 1517-1521, 2009
Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings
Micro-compression testing using an instrumented micro- or nanoindenter equipped with a flat punch is a promising approach to measure the stress-strain response of miniaturized materials and to complement hardness and modulus measurements gained by nanoindendation. Focussed ion beam milling is employed to fabricate micron-sized compression pillars from 1 mu m thick single crystal Cu(001), TiN(001) and VN(001), films grown on MgO(001), and from a 6.7 mu m thick polycrystalline W coating deposited on Si(001). In situ micro-compression tests in a scanning electron microscope reveal reproducible stress-strain curves for W. a considerable statistical scatter in the flow stress for Cu and VN, and failure of TiN pillars by cleavage. A linear work-hardening rate of 2.7 +/- 1.2 GPa is determined for the polycrystalline W coating. The results are critically discussed taking into account material defects and the stiffness of the film-substrate system. (C) 2009 Elsevier B.V. All rights reserved.