The extended application of focused ion beam (FIB) technology is dependent on the complicated reciprocal relation of operating parameters, which influence the FIB processes. Undesired surface damage by the FIB milling process must be reduced for successful and efficient modifications on the surface of a silicon substrate. In general, the dwell time, the beam irradiated pixel spacing, and the pattern size were considered as the stage control parameters during the milling process. In order to reduce the surface damage, the influence of the parameters on FIB milling process was examined with respect to the dimensions of the milled pattern. (C) 2007 Elsevier B.V. All rights reserved.