The adhesion strength of various photosensitive epoxies with copper or FR4 substrate was measured by the stud pull testing method. The adhesion strength was around 35-60 kg/cm(2) for photosensitive epoxy/copper laminate and 60-105 kg/cm(2) for photosensitive epoxy/FR-4 laminate. A high adhesion strength of metal/photosensitive epoxy can be obtained when the surface of photosensitive epoxy is subjected to 1 minute of microetching in the processes of metallization. Under such a processing condition, the adhesion strength of copper/photosensitive epoxy for Taiyo PVI-500/SA-50 can be as high as 145 kg/cm(2), and the adhesion strength remained higher than 145 kg/cm(2) after the solder float test.