A new technique for producing thin single-crystal silicon solar cells has been developed. The new technology allows for large decreases in silicon usage by a factor of 12 (including kerf losses) compared to conventional crystalline silicon wafer technologies. The new Sliver (R) cell process uses a micromachining technique to form 60 mu m-thick solar cells, fully processed while they are still supported by the silicon substrate at the edge of the wafer. The Sliver (R) solar cells are capable of excellent performance due to their thickness and unique cell design with demonstrated efficiencies over 19.3% and open-circuit voltages of 683 mV. In addition, the cells are bifacial (accepts light from either sides) and very flexible. Several prototype modules have been fabricated using a new design approach that introduces a diffuse reflector to the rear of a bi-glass module. To save expensive silicon material, a significant gap is kept between cells. The light striking between cells is scattered from the rear reflector and is directed onto the rear surface of the bifacial Sliver (R) cells. Module efficiency of 13% (AM1.5, 25C) has been demonstrated with a module presenting a 50% solar-cell coverage fraction, and 18.3% with a 100% Sliver (R) cell coverage fraction. (c) 2006 Elsevier B.V. All rights reserved.