The creep performance of a material is one of the main criteria currently used to assess the long-term performance of thermoplastic composites. In a wide number of applications, including electrical connectors and various automotive applications, dimensional stability at elevated temperatures (i.e., short-term creep performance) is an essential design requirement. In many of these applications the material can be exposed to elevated temperatures and high applied stresses as part of the fabrication process or in the end-use application. The elevated temperature creep behavior of 30%, and 40% glass-filled syndiotactic polystyrene, 30% glass-filled poly(butylene terephthalate), 30% glass-filled poly( phenylene sulfide), and a 30% glass-filled liquid crystalline polymer has been evaluated. The creep behavior for each of the materials has been modeled using the formulation proposed by Findley, Kholsa, and Petersen (FKP). The FKP model was found to provide a good description of the creep performance of these glass-filled materials. The parameters in the FKP model were evaluated for each of the materials as a function of temperature and applied stress. Comparison of the predicted short-term creep behavior using the FKP model with experimental data has shown that the predicted creep behavior is within +/-10% of the measured value over the temperature and applied stress ranges examined.