The development and production of three-dimensional, injection moulded circuit boards (3D-MID) is a relatively new technology with complex requirements depending on the application and high demands on the material to be processed. Nonetheless, successful developments, which are ready for commercial production, prove that the high requirements can be met if the development process is adapted to MID technology and the material and process selection is based on a qualified assessment. Thus, this technology has potential for wider use. The current activities of MID producers, line manufacturers, raw material producers and research institutes confirm this trend.