It has been shown that an under-layer of SiO2 center dot nH(2)O on a silicate glass surface, promotes the adsorption of Sn(II) hydroxycompounds, resulting in the formation of Sn-O-Si chemical bonds. It also: contributes to the formation of monodispersed Sn(II) compound nanoparticles; levels the glass surface micro-relief; ensures the deposition of fine-grained metal films; increases the rate of Ni-P and Cu electroless plating; and increases the rate of the adhesion interaction between the surface of the silicate glass and metal films. It opens up the possibility of electroless and electrochemical plating of 5-10 mu m thick multilayer metal and alloy films. (C) Koninklijke Brill NV, Leiden, 2011