The choice of polymeric materials in electronic packaging influences not only the performance parameters of electronic devices, but also their long-term reliability Adverse conditions such as humidity, high temperature, and vibration prevent the electronic devices from functioning in the way that they were designed. This paper presents the results of experimental work aimed at studying the properties of new room temperature-setting polydiene urethane adhesives (PUAs). Based on hydroxyl-containing oligodiene urethanes, new PUAs were investigated for their mechanical and dielectric properties. It was found that the adhesives were highly elastic, stable against temperature and humidity, and had good dielectric characteristics. Reliability tests on printed circuit boards with the bonded electronic components were carried out in various conditions. The electrical resistance changes of bonded resistors were found to be in the range of 0.03-1.4% after all tests. It can be concluded that these adhesives do not adversely affect the performance of electronic components and can be used for the assembling of electronic devices in addition to conventional soldering.