This work deals with the study of the durability, in a hot/wet environment, of structural adhesively bonded polyetherimide (PEI) assemblies used in power electronics packaging technology. An overall approach is proposed, for which the epoxy joint-PEI substrates assembly on the one hand, and the adhesive system components (substrate surface and bulk adhesive) on the other hand, are studied separately with different analytical techniques. The first part of this work was devoted to the substrate surface state and to its modification using a cold plasma treatment of the PEI surface. Then for chosen parameters (power, duration) contact angle measurements indicated an increased surface tension resulting from surface decontamination (removal of release agent and carbon contaminants) and from the creation of polar species, such as esters or carboxylic acid groups, on the PEI surface (XPS analyses). The second part of this study concerned the bulk adhesive ageing in an ethylene glycol-water solution at 70degreesC. Mass uptake measurements versus time showed the liquid diffusion in the bulk adhesive associated with a microscopic damage of the epoxy system. An overall plasticizing of the adhesive with a considerable decay of the alpha-transition temperature of one of the two adhesive epoxy-amine networks (TGDDM-BAPP) was also highlighted using rheometry. However, in these ageing conditions, the adhesive glassy modulus decreases slighty because of the thermomechanical stability of the other epoxy network. In the third part, the asymmetric wedge test showed the beneficial effect of the cold plasma treatment on the epoxy/PEI interface durability in the aggressive medium.