Scratch and pull-off methods for adhesion measurement were applied to various film/substrate systems. The film crystallographic structure was investigated by transmission electron microscopy (TEM) in order to correlate it to the adhesion strength. We also correlate the film and substrate electronic structures (in particular the electronegativity) to the adhesion strength. The results of adhesion measurement are also discussed with respect to the substrate temperature. The main results are that the adhesion strength is greater when the film is deposited on magnesium oxide than on alumina substrates, and for the copper than for the gold deposit. Also, the adhesion strength increases with the substrate temperature.