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Proceedings of the First International SiGe Technology and Device Meeting (ISTDM 2003) - From materials and process technology to device and circuit technology - 15-17 January, 2003 - Nagoya University Symposion, Nagoya, Japan - Preface Murota J, Tillack B, Caymax M, Sturm J, Yasuda Y, Zaima S |
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Challenges of high Ge content silicon germanium structures Kasper E, Heim S |
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The revolution in SiGe: impact on device electronics Harame DL, Koester SJ, Freeman G, Cottrel P, Rim K, Dehlinger G, Ahlgren D, Dunn JS, Greenberg D, Joseph A, Anderson F, Rieh JS, Onge SAST, Coolbaugh D, Ramachandran V, Cressler JD, Subbanna S |
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Selective epitaxial growth of SiGe : C for high speed HBTs Schafer H, Bock J, Stengl R, Knapp H, Aufinger K, Wurzer M, Boguth S, Rest M, Schreiter R, Meister TF |
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Avoiding loading effects and facet growth - Key parameters for a successful implementation of selective epitaxial SiGe deposition for HBT-BiCMOS and high-mobility hetero-channel pMOS devices Loo R, Caymax M |
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N-2 as carrier gas: an alternative to H-2 for enhanced epitaxy of Si, SiGe and SiGe : C Meunier-Beillard P, Caymax M, Van Nieuwenhuysen K, Doumen G, Brijs B, Hopstaken M, Geenen L, Vandervorst W |
36 - 40 |
Production-ready dry cleaning and deposition processes for low-temperature Si and SiGe epitaxy Buschbeck HM, Erhart A, Goeggel Y, Rosenblad C, Wiltsche S, Ramm J, Dommann A, Kummer M |
41 - 45 |
Low temperature, high growth rate epitaxial silicon and silicon germanium alloy films Todd MA, Weeks KD |
46 - 50 |
Growth of high quality epitaxial Si1-x-yGexCy layers by using chemical vapor deposition Hallstedt J, Suvar E, Persson POA, Hultman L, Wang YB, Radamson HH |
51 - 54 |
Characterization of Ge gradients in SiGeHBTs by AES depth profile simulation Kruger D, Penkov A, Yamamoto Y, Goryachko A, Tillack B |
55 - 58 |
High performance SiGe : C HBTs using atomic layer base doping Tillack B, Yamamoto Y, Knoll D, Heinemann B, Schley P, Senapati B, Kruger D |
59 - 62 |
On the mechanism of ion-implanted As diffusion in relaxed SiGe Eguchi S, Lee JJ, Rhee SJ, Kwong DL, Lee ML, Fitzgerald EA, Aberg I, Hoyt JL |
63 - 67 |
A new technique to fabricate ultra-shallow-junctions, combining in situ vapour HCl etching and in situ doped epitaxial SiGe re-growth Loo R, Caymax M, Meunier-Beillard P, Peytier I, Holsteyns F, Kubicek S, Verheyen P, Lindsay R, Richard O |
68 - 72 |
In situ B doping of SiGe(C) using BCl3 in ultraclean hot-wall LPCVD Kunii Y, Inokuchi Y, Moriya A, Kurokawa H, Murota J |
73 - 76 |
Low-temperature dopant activation technology using elevated Ge-S/D structure Takeuchi H, Ranade P, King TJ |
77 - 81 |
Relationship between impurity (B or P) and carrier concentration in SiGe(C) epitaxial film produced by thermal treatment Noh J, Takehiro S, Sakuraba M, Murota J |
82 - 86 |
Characterization of As+ ion-implanted layers in strained-Si/SiGe/Si hetero-structures Ishida T, Irieda S, Inada T, Sugii N |
87 - 90 |
Segregation of boron to polycrystalline and single-crystal Si-1-(x)-yGexCy and Si1-yCy layers Stewart EJ, Sturm JC |
91 - 94 |
Development of a new type of SiGe thin strain relaxed buffer based on the incorporation of a carbon-containing layer Delhougne R, Meunier-Beillard P, Caymax M, Loo R, Vandervorst W |
95 - 98 |
Fabrication of SiGe-on-insulator by rapid thermal annealing of Ge on Si-on-insulator substrate Kutsukake K, Usami N, Fujiwara K, Ujihara T, Sazaki G, Nakajima K, Zhang BP, Segawa Y |
99 - 103 |
Formation of thin SiGe virtual substrates by ion implantation into Si substrates Sawano K, Koh S, Hirose Y, Hattori T, Nakagawa K, Shiraki Y |
104 - 107 |
Strain-relaxation mechanisms of SiGe layers formed by two-step growth on Si(001) substrates Egawa T, Sakai A, Yamamoto T, Taoka N, Nakatsuka O, Zaima S, Yasuda Y |
108 - 112 |
Dislocation structures and strain-relaxation in SiGe buffer layers on Si(001) substrates with an ultra-thin Ge interlayer Yamamoto T, Sakai A, Egawa T, Taoka N, Nakatsuka O, Zaima S, Yasuda Y |
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Strain relaxation of strained-Si layers on SiGe-on-insulator (SGOI) structures after mesa isolation Usuda K, Mizuno T, Tezuka T, Sugiyama N, Moriyama Y, Nakaharai S, Takagi S |
117 - 121 |
Influence of Si1-xGex interlayer on the initial growth of SiGeC on Si(100) Ariyoshi S, Takeuchi S, Nakatsuka O, Sakai A, Zaima S, Yasuda Y |
122 - 126 |
Roughening mechanisms of tensily strained Si1-x-yGexCy films grown by UHV-CVD: evidence of a carbon surface diffusion related mechanism Calmes C, Bouchier D, Clerc C, Zheng YL |
127 - 133 |
Intermixing in Ge hut cluster islands Denker U, Sigg H, Schmidt OG |
134 - 138 |
Selective epitaxial growth of Ge quantum dots on patterned SiO2/Si(001) surfaces Nguyen LH, LeThanh V, Debarre D, Yam V, Halbwax M, El Kurdi M, Bouchier D, Rosner P, Becker M, Benamara M, Strunk HP |
139 - 142 |
Shape and composition change of Ge dots due to Si capping Kirfel O, Muller E, Grutzmacher D, Kern K, Hesse A, Stangl J, Holy V, Bauer G |
143 - 147 |
Kinetics of Si capping process of Ge/Si(001) quantum dots Yam V, Le Thanh V, Debarre D, Zheng Y, Bouchier D |
148 - 151 |
Optical properties of stacked Ge/Si quantum dots with different spacer thickness grown by chemical vapor deposition Chen WY, Chang WH, Chou AT, Hsu TM, Chen PS, Pei ZW, Lai LS |
152 - 155 |
Improved growth of Ge quantum dots in Ge/Si stacked layers by pre-intermixing treatments Lee SW, Chen LJ, Chen PS, Tsai MJ, Liu CW, Chen WY, Hsu TM |
156 - 159 |
Influence of thermal annealing on compositional mixing and crystallinity of highly selective grown Si dots with Ge core Darma Y, Murakami H, Miyazaki S |
160 - 164 |
Coupling effect dependent on the thickness of the spacer layer between double layers of quantum dots Rao Y, Gao Q, Jiang ZM, Lu F |
165 - 169 |
Room temperature 1.3 and 1.5 mu m electroluminescence from Si/Ge quantum dots (QDs)/Si multi-layers Pei Z, Chen PS, Lee SW, Lai LS, Lu SC, Tsai MJ, Chang WH, Chen WY, Chou AT, Hsu TM |
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SiGePIN photodetector for infrared optical fiber links operating at 1.25 Gbit/s Jutzi M, Berroth M, Wohl G, Parry C, Oehme M, Bauer M, Schollhorn C, Kasper E |
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Fabrication of epitaxial SiGe optical waveguide structures Kim YW, Berlin D, Samoilov A |
179 - 182 |
GeH4 adsorption on Si(001) at RT: transfer of H atoms to Si sites and atomic exchange between Si and Ge Murata T, Suemitsu M |
183 - 187 |
Adsorption kinetics of dimethylsilane at Si(001) Senthil K, Nakazawa H, Suemitsu M |
188 - 192 |
Kinetics of epitaxial growth of Si and SiGe films on (110)Si substrates Sugiyama N, Moriyama Y, Nakaharai S, Tezuka T, Mizuno T, Takagi S |
193 - 196 |
Local atomic structure in Czochralski-grown Ge1-xSix bulk alloys Yonenaga I, Sakurai M, Sluiter MHF, Kawazoe Y |
197 - 201 |
Epitaxial growth of N delta doped Si films on Si(100) by alternately supplied NH3 and SiH4 Jeong YC, Sakuraba M, Murota J |
202 - 205 |
Formation of heavily P-doped Si epitaxial film on Si(100) by multiple atomic-layer doping technique Shimamune Y, Sakuraba M, Murota J, Tillack B |
206 - 209 |
Effect of carbon on the thermal stability of a Si atomic layer on Ge(100) Fujiu M, Takahashi K, Sakuraba M, Murota J |
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Ar plasma irradiation effects in atomically controlled Si epitaxial growth Muto D, Sakuraba M, Seino T, Murota J |
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Interfacial reaction and electrical properties in Ni/Si and Ni/SiGe(C) contacts Zaima S, Nakatsuka O, Sakai A, Murota J, Yasuda Y |
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Reactive ion etching of Si1-xGex alloy with hydrogen bromide Wang CS, Shu DY, Hsieh WY, Tsai MJ |
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Ge-dependent morphological change in poly-SiGe formed by Ni-mediated crystallization Sadoh T, Kanno H, Kenjo A, Miyao M |
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Enhanced crystal nucleation in a-SiGe/SiO2 by ion-irradiation assisted annealing Tsunoda I, Kenjo A, Sadoh T, Miyao M |
235 - 240 |
Numerical simulation of strained Si/SiGe devices: the hierarchical approach Meinerzhagen B, Jungemann C, Neinhus B, Bartels M |
241 - 247 |
Fabrication and device characteristics of strained-Si-on-insulator (strained-SOI) CMOS Takagi SI, Mizuno T, Tezuka T, Sugiyama N, Numata T, Usuda K, Moriyama Y, Nakaharai S, Koga J, Tanabe A, Maeda T |
248 - 253 |
Mobility and performance enhancement in compressively strained SiGe channel PMOSFETs Shi ZH, Onsongo D, Banerjee SK |
254 - 259 |
Fabrication of 0.12 mu m pMOSFETs on high Ge fraction Si/Si1-xGex/Si(100) heterostructure with ultrashallow source/drain formed using B-doped SiGeCVD Lee D, Takehiro S, Sakuraba M, Murota J, Tsuchiya T |
260 - 264 |
SiGe elevated source/drain structure and nickel silicide contact layer for sub 0.1 mu m MOSFET fabrication Shim J, Oh H, Choi H, Sakaguchi T, Kurino H, Koyanagi M |
265 - 269 |
Low-frequency noise suppression and dc characteristics enhancement in sub-mu m metamorphic p-MOSFETs with strained Si0.3Ge0.7 channel grown by MBE Myronov M, Durov S, Mironov OA, Parker EHC, Whall TE, Hackbarth T, Hock G, Herzog HJ, Konig U |
270 - 273 |
Proposal of a multi-layer channel MOSFET: the application of selective etching for Si/SiGe stacked layers Sasaki D, Ohmi S, Sakuraba M, Murota J, Sakai T |
274 - 277 |
Electrical properties Of Si1-yCy/Si/SiO2 interface for sub 50 nm strained-channel nMOSFETs Ducroquet F, Ernst T, Weber O, Hartmann JM, Loup V, Besson P, Brevard L, Di Maria JL, Deleonibus S |
278 - 282 |
Analysis of carrier generation lifetime in strained-Si/SiGe heterojunction MOSFETs from capacitance transient Bera LK, Mathew S, Balasubramanian N, Braithwaite G, Currie MT, Singaporewala F, Yap J, Hammond R, Lochtefeld A, Bulsara MT, Fitzgerald EA |
283 - 287 |
Minority carrier lifetime and diffusion length in Si1-x-yGexCy and Si1-yCy heterolayers Samanta SK, Dalapati GK, Chatterjee S, Maiti CK |
288 - 291 |
Electrical propel-ties of ZrO2 films on Si1-x-yGexCy epitaxial layers Chatterjee S, Dalapati GK, Samanta SK, Maiti CK |
292 - 296 |
Fabrication of 50 nm high performance strained-SiGe pMOSFETs with selective epitaxial growth Loo R, Collaert N, Verheyen P, Caymax M, Delhougne R, De Meyer K |
297 - 305 |
Circuit applications of high-performance SiGe : C HBTs integrated in BiCMOS technology Winkler W, Borngraber J, Heinemann B, Rucker H, Barth R, Bauer J, Bolze D, Drews J, Ehwald KE, Grabolla T, Haak U, Hoppner W, Knoll D, Kruger D, Kuck B, Kurps R, Marschmeyer M, Richter H, Schley P, Schmidt D, Scholz R, Tillack B, Wolansky D, Wulf HE, Yamamoto Y, Zaumseil P |
306 - 311 |
High-speed SiGeHBTs and their applications Washio K |
312 - 319 |
The state-of-the-art in simulation for optimization of SiGe-HBTs Palankovski V, Selberherr S |
320 - 323 |
Influence of the extrinsic base on the base current kink in SiGeBJTs Sadovnikov A, Krakowski T, El-Diwany M |
324 - 329 |
Design and optimization of a 200 GHz SiGeHBT collector profile by TCAD Stricker AD, Johnson JB, Freeman G, Rieh JS |
330 - 335 |
The effect of C on emitter-base design for a single-polysilicon SiGe : C HBT with an IDP emitter Haralson E, Suvar E, Malm G, Radamson H, Wang YB, Ostling M |
336 - 340 |
Characterization of leakage current related to a selectively grown collector in SiGeC heterojunction bipolar transistor structure Suvar E, Haralson E, Radamson HH, Wang YB, Grahn JV, Malm BG, Ostling M |
341 - 346 |
Reliability properties of SiGeHBTs Rennane A, Bary L, Roux JL, Kuchenbecker J, Graffeuil J, Plana R |
347 - 349 |
Achieving a SiGeHBT epitaxial emitter with novel low thermal budget technique Brabant P, Wen JQ, Italiano J, Landin T, Cody N, Haen L |
350 - 353 |
Evaluation of compact noise modeling for Si/SiGe HBTs based on hierarchical hydrodynamic noise simulation Bartels M, Neinhus B, Jungemann C, Meinerzhagen B |
354 - 360 |
Comparison of state-of-the-art bipolar compact models for SiGe-HBTs Chakravorty A, Garg R, Maiti CK |
361 - 364 |
Rigorous modeling approach to numerical simulation of SiGeHBTs Palankovski V, Rohrer G, Grasser T, Smirnov S, Kosina H, Selberherr S |
365 - 369 |
Direct extraction feature for scattering parameters of SiGe-HBTs Wagner S, Palankovski V, Rohrer G, Grasser T, Selberherr S |
370 - 376 |
Microwave performances of silicon heterostructure-FETs Aniel F, Enciso M, Richard S, Giguerre L, Zerounian N, Crozat P, Adde R, Hackbarth T, Herzog JH, Konig U |
377 - 381 |
Resonant tunneling in Si-SiGe superlattices on relaxed buffer substrates Tsujino S, Mentese S, Diehl L, Muller E, Haas B, Bachle D, Stutz S, Grutzmacher D, Campidelli Y, Kermarrec O, Bensahel D |
382 - 385 |
60 nm gate-length Si/SiGe HEMT Kasamatsu A, Kasai K, Hikosaka K, Matsui T, Mimura T |
386 - 389 |
SiGe virtual substrate HMOS transistor for analogue applications Michelakis K, Despotopoulos S, Gaspari V, Vilches A, Fobelets K, Papavassiliou C, Toumazou C, Zhang J |
390 - 393 |
Effect of temperature on the transfer characteristic of a 0.5 mu m-gate Si : SiGe depletion-mode n-MODFET Gaspari V, Fobelets K, Velazquez-Perez JE, Ferguson R, Michelakis K, Despotopoulos S, Papavassilliou C |
394 - 398 |
Nonvolatile memory based on Ge/Si hetero-nanocrystals Yang HG, Shi Y, Pu L, Zhang R, Shen B, Han P, Gu SL, Zheng YD |
399 - 404 |
Si/SiGe heterojunction collector for low loss operation of Trench IGBT Kudoh T, Asano T |
405 - 409 |
High performance rf front end circuits using SiGe : C BiCMOS plus copper technologies Watanabe G, Ortiz J, Holbrook R |
410 - 418 |
Low-cost circuit solutions for micro- and millimeter-wave systems using commercially available SiGe technologies Schumacher H, Abele P, Sonmez E, Schad KB, Trasser A |
419 - 424 |
SiGe based low noise amplifier for WLAN applications Sadowy J, Dubuc D, Busquere JP, Grenier K, Telliez I, Graffeuil J, Tournier E, Plana R |
425 - 428 |
The comparison of isolation technologies and device models on SiGe bipolar low noise amplifier Hua WC, Yang TY, Liu CW |
429 - 433 |
A 4.4 to 5 GHz SiGe low noise amplifier Crippa P, Orcioni S, Ricciardi F, Turchetti C |
434 - 438 |
A DC-5 GHz NMOSFET SPDT T/R switch in 0.25-mu m SiGeBiCMOS technology Crippa P, Orcioni S, Ricciardi F, Turchetti C |