1 - 2 |
13th applied surface analysis workshop (AOFA 13) Wetzig K |
3 - 10 |
Depth profile and interface analysis in the nm-range Oswald S, Reiche R, Zier M, Baunack S, Wetzig K |
11 - 17 |
Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects Traving M, Zienert I, Zschech E, Schindler G, Steinhogl W, Engelhardt A |
18 - 23 |
New physical techniques for IC functional analysis of on-chip devices and interconnects Boit C |
24 - 30 |
Visible-light attachment of Si-C linked functionalized organic monolayers on silicon surfaces de Smet LCPM, Pukin AV, Sun QY, Eves BJ, Lopinski GP, Visser GM, Zuilhof H, Sudholter EJR |
31 - 42 |
Elementary processes at semiconductor/electrolyte interfaces: Perspectives and limits of electron spectroscopy Mayer T, Lebedev M, Hunger R, Jaegermann W |
43 - 48 |
Morphological and elemental characterisation with the high-energy ion-nanoprobe LIPSION Butz T, Meinecke C, Morawski M, Reinert T, Schwertner M, Spemann D |
49 - 52 |
Comparison of reference-free X-ray fluorescence analysis and X-ray reflectometry for thickness determination in the nanometer range Kolbe M, Beckhoff B, Krumrey M, Ulm G |
53 - 56 |
Determination of layer thickness with mu XRF Vogt C, Dargel R |
57 - 60 |
Laboratory LPP EUV reflectorneter working with non-polarized radiation van Loyen L, Bottger T, Schadlich S, Braun S, Foltyn T, Leson A, Scholze F, Mullender S |
61 - 65 |
Quantitative XPS imaging - new possibilities with the delay-line detector Vohrer U, Blomfield C, Page S, Roberts A |
66 - 76 |
A combined SNMS and EFTEM/EELS study on focused ion beam prepared vanadium nitride thin films Kothleitner G, Rogers M, Berendes A, Bock W, Kolbesen BO |
77 - 80 |
Chemisorption at interfaces between organic semiconductors and metals: role of the electron affinity Knupfer M, Schwieger T |
81 - 84 |
IR and SFM study of PTCDA thin films on different substrates Berger S, Heimer K, Mack HG, Ziegler C |
85 - 88 |
Photoelectron spectroscopy of nanocrystalline anatase TiO2 films Orendorz A, Wusten J, Ziegler C, Gnaser H |
89 - 93 |
Characterization of thin Ta-Si-N-x layers of different nitrogen content using XPS, UPS and STM Zahn W, Hildebrand D, Menzel S, Oswald S, Heuer H |
94 - 97 |
Nm-scale resolution studies of the bond interface between ultrasonically welded Al-alloys by an analytical TEM: a path to comprehend bonding phenomena? Brodyanski A, Bom C, Kopnarski M |
98 - 103 |
On the cleaning of monocrystalline metallic samples from impurities Arabczyk W, Narkiewicz U |
104 - 107 |
Post deposition purification of PTCDA thin films Wusten J, Ertl T, Lach S, Ziegler C |
108 - 112 |
Corrosion of aluminium components studied with MIES, UPS and XPS Frerichs M, Voigts F, Hollunder S, Masendorf R, Esderts A, Maus-Friedrichs W |
113 - 116 |
Analytical methods for the characterisation of leaf surfaces: a contribution to understand the processes of biomineralization Hinke S, Marx G, Fehlhaber R, Wienhaus O |
117 - 122 |
Initial bioadhesion on surfaces in the oral cavity investigated by scanning force microscopy Schwender N, Huber K, Al Marrawi F, Hannig M, Ziegler C |
123 - 126 |
Low energy RBS and SIMS analysis of the SiGe quantum well Krecar D, Rosner M, Draxler M, Bauer P, Hutter H |
127 - 132 |
Quantitative element mapping of Mg alloys by laser ablation ICP-MS and EPMA Latkoczy C, Muller Y, Schmutz P, Gunther D |
133 - 138 |
Investigations of corrosion phenomena. on gold coins with SIMS Mayerhofer KE, Piplits K, Traum R, Griesser M, Hutter H |
139 - 142 |
Alkyl chain effects in thin films of substituted phthalocyanines studied using infrared spectroscopy Haug A, Harbeck S, Dini D, Hanack M, Cook MJ, Peisert H, Chasse T |
143 - 147 |
Electronic properties of the organic semiconductor hetero-interface CUPc/C-60 Molodtsova OV, Schwieger T, Knupfer M |
148 - 153 |
XPS investigation of the PTFE induced hydrophobic properties of electrodes for low temperature fuel cells Schulze M, Christenn C |
154 - 157 |
Protein adsorption on solid-liquid interfaces monitored by laser-ellipsometry Seitz R, Brings R, Geiger R |
158 - 161 |
Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers Stangl M, Dittel V, Acker J, Hoffmann V, Gruner W, Strehle S, Wetzig K |
162 - 166 |
Characterization of oxide layers on amorphous Zr-based alloys by Auger electron spectroscopy with sputter depth profiling Baunack S, Mudali UK, Gebert A |
167 - 171 |
Analysis of Mg-B compounds by means of Auger electron microprobe Baunack S, Perner O, Fischer C |
172 - 176 |
Surface characterisation and interface studies of high-k materials by XPS and TOF-SIMS Besmehn A, Scholl A, Rije E, Breuer U |
177 - 184 |
Comparing the chemical properties of evaporated and sputtered niobium films on oxidized Si(100) wafers - preparation of oxynitride films Brunkahl O, Bock W, Thoma K, Kolbesen BO |
185 - 188 |
Investigation of ultrathin tantalum based diffusion barrier films using AES and TEM Dittmar K, Engelmann HJ, Peikert M, Wieser E, Borany JV |
189 - 195 |
First nucleation steps of vanadium oxide thin films studied by XPS inelastic peak shape analysis Gracia F, Yubero F, Espinos JP, Gonzalez-Elipe AR |
196 - 199 |
Electronic structure and topography of annealed SrTiO3(111) surfaces studied with MIES and STM Gomann A, Gomann K, Frerichs M, Kempter V, Borchardt G, Maus-Friedrichs W |
200 - 204 |
Mechanical stress in ALD-Al2O3 films Krautheim G, Hecht T, Jakschik S, Schroder U, Zahn W |
205 - 210 |
Formation of niobium oxynitrides by rapid thermal processing (RTP) Matylitskaya VA, Bock W, Thoma K, Kolbesen BO |
211 - 214 |
Effect of Ag-alloying addition on the stress-temperature behavior of electroplated copper thin films Menzel S, Strehle S, Wendrock H, Wetzig K |
215 - 217 |
Material transport in Al-metallizations of power-loaded SAW structures Menzel S, Pekarcikova M, Hofmann M, Gemming T, Wetzig K |
218 - 222 |
XPS and AES investigations, of hard magnetic Nd-Fe-B films Oswald S, Fahler S, Baunack S |
223 - 226 |
Characterization of PECVD boron carbonitride layers Thamm T, Korner KU, Bohne W, Strub E, Rohrich J, Stockel S, Marx G |
227 - 233 |
Analysis of chemical dissolution of the barrier layer of porous oxide on aluminum thin films using a re-anodizing technique Vrublevsky I, Parkoun V, Sokol V, Schreckenbach J |
234 - 239 |
XPS and ARXPS investigations of ultra thin TaN films deposited on SiO2 and Si Zier M, Oswald S, Reiche R, Wetzig K |
240 - 244 |
Advances in X-ray excitation of Kossel patterns by a focusing polycapillary lens Langer E, Dabritz S, Hauffe W, Haschke M |
245 - 251 |
Shells on nanowires detected by analytical TEM Thomas J, Gemming T |
252 - 256 |
Multivariate data analysis for depth resolved chemical classification and quantification of sulfur in SNMS Sommer M, Goschnick J |
257 - 260 |
SNMS investigations of platinum-doped nanogranular tin dioxide layers Schneider T, Sommer M, Goschnick J |
261 - 265 |
Analysis of new electrical signals in respect to quantification of radio frequency glow discharge emission spectrometry Wilken L, Hoffmann V, Wetzig K |
266 - 270 |
Characterisation of molybdenum intermediate layers in Cu-C system with SIMS method Mayerhofer KE, Schrank C, Eisenmenger-Sittner C, Hutter H |
271 - 277 |
Range evaluation in SIMS depth profiles of Er-implantations in silicon Mayerhofer K, Foisner H, Piplits K, Hobler G, Palmetshofer L, Hutter H |
278 - 281 |
SIMS investigation of gettering centres produced by phosphorus MeV ion implantation Krecar D, Fuchs M, Kogler R, Hutter H |
282 - 285 |
2D and 3D SIMS investigations on sintered steels Krecar D, Zwanziger J, Vassileva V, Danninger H, Hutter H |