3131 - 3132 |
Foreword Hartmann JM |
3133 - 3138 |
Low temperature Si:C co-flow and hybrid process using Si3H8/Cl-2 Bauer M, Thomas SG |
3139 - 3143 |
Low temperature catalyst enhanced etch process with high etch rate selectivity for amorphous silicon based alloys over single-crystalline silicon based alloys Bauer M, Thomas SG |
3144 - 3148 |
Low temperature selective epitaxial growth of SiCP on Si(110) oriented surfaces Bauer M, Thomas SG |
3149 - 3154 |
Ultra-low resistivity in-situ phosphorus doped Si and SiC epitaxy for source/drain formation in advanced 20 nm n-type field effect transistor devices Loubet N, Adam T, Raymond M, Liu Q, Cheng KG, Sreenivasan R, Reznicek A, Khare P, Kleemeier W, Paruchuri V, Doris B, Sampson R |
3155 - 3157 |
Effect of Thermal Annealing on Carbon in In-situ Phosphorous-Doped Si1-xCx films Adam T, Loubet N, Reznicek A, Paruchuri V, Sampson R, Sadana D |
3158 - 3162 |
Characterization and analysis of epitaxial silicon phosphorus alloys for use in n-channel transistors Weeks KD, Thomas SG, Dholabhai P, Adams J |
3163 - 3169 |
Faceting and nanostructure effects in Si and SiGe epitaxy Dutartre D, Seiss B, Campidelli Y, Pellissier-Tanon D, Barge D, Pantel R |
3170 - 3174 |
SiGe channels for V-T control of high-k metal gate transistors for 32 nm complementary metal oxide semiconductor technology and beyond Reichel C, Schoenekess J, Kronholz S, Beernink G, Zeun A, Dietel A, Kammler T |
3175 - 3178 |
High strain embedded-SiGe via low temperature reduced pressure chemical vapor deposition He H, Brabant P, Chung K, Shinriki M, Adam T, Reznicek A, Sadana D, Hasaka S, Francis T |
3179 - 3184 |
Growth of high Ge content SiGe on (110) oriented Si wafers Hikavyy A, Vanherle W, Vincent B, Dekoster J, Bender H, Moussa A, Witters L, Hoffman T, Loo R |
3185 - 3189 |
A benchmarking of silane, disilane and dichlorosilane for the low temperature growth of group IV layers Hartmann JM, Benevent V, Damlencourt JF, Billon T |
3190 - 3194 |
Gas phase particle formation and elimination on Si (100) in low temperature reduced pressure chemical vapor deposition silicon-based epitaxial layers Shinriki M, Chung K, Hasaka S, Brabant P, He H, Adam TN, Sadana D |
3195 - 3200 |
Growth of silicon based germanium tin alloys Kasper E, Werner J, Oehme M, Escoubas S, Burle N, Schulze J |
3201 - 3205 |
Growth of Ge1-xSnx heteroepitaxial layers with very high Sn contents on InP(001) substrates Nakamura M, Shimura Y, Takeuchi S, Nakatsuka O, Zaima S |
3206 - 3210 |
In-situ Ga doping of fully strained Ge1-xSnx heteroepitaxial layers grown on Ge(001) substrates Shimura Y, Takeuchi S, Nakatsuka O, Vincent B, Gencarelli F, Clarysse T, Vandervorst W, Caymax M, Loo R, Jensen A, Petersen DH, Zaima S |
3211 - 3215 |
Low-temperature Ge and GeSn Chemical Vapor Deposition using Ge2H6 Gencarelli F, Vincent B, Souriau L, Richard O, Vandervorst W, Loo R, Caymax M, Heyns M |
3216 - 3221 |
Low threading dislocation Ge on Si by combining deposition and etching Yamamoto Y, Kozlowski G, Zaumseil P, Tillack B |
3222 - 3226 |
Epitaxial growth of relaxed germanium layers by reduced pressure chemical vapour deposition on (110) and (111) silicon substrates Nguyen VH, Dobbie A, Myronov M, Norris DJ, Walther T, Leadley DR |
3227 - 3231 |
Reverse graded strain relaxed SiGe buffers for CMOS and optoelectronic integration Shah VA, Dobbie A, Myronov M, Leadley DR |
3232 - 3235 |
Electrical characterization of wafer-bonded Ge(111)-on-insulator substrates using four-point-probe pseudo-metal-oxide-semiconductor field-effect transistor method Minami K, Nakamura Y, Yamasaka S, Yoshitake O, Kikkawa J, Izunome K, Sakai A |
3236 - 3239 |
Generation of uniaxial tensile strain of over 1% on a Ge substrate for short-channel strained Ge n-type Metal-Insulator-Semiconductor Field-Effect Transistors with SiGe stressors Moriyama Y, Kamimuta Y, Ikeda K, Tezuka T |
3240 - 3244 |
Preparation and characterization of Ge epitaxially grown on nano-structured periodic Si pillars and bars on Si(001) substrate Zaumseil P, Yamamoto Y, Bauer J, Schubert MA, Matejova J, Kozlowski G, Schroeder T, Tillack B |
3245 - 3248 |
Vertical dislocations in Ge films selectively grown in submicron Si windows of patterned substrates Harada S, Kikkawa J, Nakamura Y, Wang G, Caymax M, Sakai A |
3249 - 3254 |
Direct and indirect radiative recombination from Ge Liu CW, Cheng TH, Chen YY, Jan SR, Chen CY, Chan ST, Nien YH, Yamamoto Y, Tillack B |
3255 - 3258 |
Effects of dose on activation characteristics of P in Ge Anisuzzaman M, Sadoh T |
3259 - 3261 |
Molecular beam epitaxy grown Ge/Si pin layer sequence for photonic devices Schulze J, Oehme M, Werner J |
3262 - 3265 |
Laser assisted formation of binary and ternary Ge/Si/Sn alloys Stefanov S, Conde JC, Benedetti A, Serra C, Werner J, Oehme M, Schulze J, Chiussi S |
3266 - 3270 |
Laser ablation and growth of Si and Ge Yap SS, Siew WO, Nee CH, Reenaas TW, Tou TY |
3271 - 3275 |
Solid-phase epitaxy of undoped amorphous silicon by in-situ postannealing Skibitzki O, Yamamoto Y, Schubert MA, Tillack B |
3276 - 3278 |
Enhancement of SiN-induced compressive and tensile strains in Si free-standing microstructures by modulation of SiN network structures Sadoh T, Kurosawa M, Heya A, Matsuo N, Miyao M |
3279 - 3282 |
Homogeneous Si0.5Ge0.5 bulk crystal growth as substrates for strained Ge thin films by the traveling liquidus-zone method Kinoshita K, Nakatsuka O, Yoda S, Zaima S |
3283 - 3287 |
Influence of SiGe layer thickness and Ge fraction on compressive strain and hole mobility in a SiGe-on-insulator substrate fabricated by the Ge condensation technique Yang HG, Wang D, Nakashima H |
3288 - 3292 |
Low temperature formation of Si1-x-yGexSny-on-insulator structures by using solid-phase mixing of Ge1-zSnz/Si-on-insulator substrates Nakatsuka O, Mochizuki K, Shimura Y, Yamaha T, Zaima S |
3293 - 3295 |
Low temperature (similar to 250 degrees C) layer exchange crystallization of Si1-xGex (x=1-0) on insulator for advanced flexible devices Park JH, Kurosawa M, Kawabata N, Miyao M, Sadoh T |
3296 - 3299 |
Doping effects on the stability of stacking faults in silicon crystals Ohno Y, Tokumoto Y, Yonenaga I |
3300 - 3303 |
Analysis of buried heterointerfacial hydrogen in highly lattice-mismatched epitaxy on silicon Yamazaki T, Asaoka H, Taguchi T, Yamamoto S, Yamazaki D, Maruyama R, Takeda M, Shamoto S |
3304 - 3308 |
Gold nanocluster distribution on faceted and kinked Si nanowires Boukhicha R, Vincent L, Renard C, Gardes C, Yam V, Fossard F, Patriarche G, Jabeen F, Bouchier D |
3309 - 3313 |
Site-controlled fabrication of dimension-tunable Si nanowire arrays on patterned (001)Si substrates Cheng SL, Lo CH, Chuang CF, Lee SW |
3314 - 3318 |
Size effect on Ge nanowires growth kinetics by the vapor-liquid-solid mechanism Renard C, Boukhicha R, Gardes C, Fossard F, Yam V, Vincent L, Bouchier D, Hajjar S, Bubendorff JL, Garreau G, Pirri C |
3319 - 3321 |
Ge and GexSi1-x islands formation on GexSi1-x solid solution surface Nikiforov AI, Timofeev VA, Teys SA, Gutakovsky AK, Pchelyakov OP |
3322 - 3325 |
Sb mediated formation of Ge/Si quantum dots: Growth and properties Tonkikh AA, Zakharov ND, Novikov AV, Kudryavtsev KE, Talalaev VG, Fuhrmann B, Leipner HS, Werner P |
3326 - 3331 |
The implant-free quantum well field-effect transistor: Harnessing the power of heterostructures Hellings G, Hikavyy A, Mitard J, Witters L, Benbakhti B, Alian A, Waldron N, Bender H, Eneman G, Krom R, Schulze A, Vandervorst W, Loo R, Heyns M, Meuris M, Hoffmann T, De Meyer K |
3332 - 3336 |
Electrical characterization of Omega-gated uniaxial tensile strained Si nanowire-array metal-oxide-semiconductor field effect transistors with < 100 >- and < 110 > channel orientations Habicht S, Feste S, Zhao QT, Buca D, Mantl S |
3337 - 3340 |
Radiation damage of Si1-xGex S/D p-type metal oxide semiconductor field effect transistor with different Ge concentrations Nakashima T, Idemoto T, Tsunoda I, Takakura K, Yoneoka M, Ohyama H, Yoshino K, Gonzalez MB, Simoen E, Claeys C |
3341 - 3344 |
Silicon interband tunneling diodes with high peak-to-valley ratios Oehme M |
3345 - 3348 |
Arsenic-doped Ge-spiked monoemitter SiGe:C heterojunction bipolar transistors by low-temperature trisilane based chemical vapor deposition You SZ, Decoutere S, Nguyen ND, Van Huylenbroeck S, Sibaja-Hernandez A, Venegas R, Loo R, De Meyer K |
3349 - 3353 |
Fluctuation of average position of electrons in Coulomb island in Si single-electron transistor Horiguchi S, Fujiwara A |
3354 - 3360 |
Ge-on-Si optoelectronics Liu JF, Camacho-Aguilera R, Bessette JT, Sun XC, Wang XX, Cai Y, Kimerling LC, Michel J |
3361 - 3364 |
Molecular beam epitaxy grown GeSn p-i-n photodetectors integrated on Si Werner J, Oehme M, Schirmer A, Kasper E, Schulze J |
3365 - 3368 |
An artificial nonradiative recombination center model created by use of a Si1-xGex/Si quantum-well-inserted pseudomorphic superlattice Terada Y, Yasutake Y, Fukatsu S |
3369 - 3373 |
A simulation study of thin film tandem solar cells with a nanoplate absorber bottom cell Chang ST, Hsieh BF, Liu YC |
3374 - 3378 |
Physics of Schottky-barrier change by segregation and structural disorder at metal/Si interfaces: First-principles study Nakayama T, Kobinata K |
3379 - 3381 |
Nickel Schottky junction on epi-Ge for strained Ge metal-oxide-semiconductor field-effect transistors source/drain engineering Lee MH, Hsieh BF, Chang ST, Lee SW |
3382 - 3386 |
Source/drain junction fabrication for Ge metal-oxide-semiconductor field-effect transistors Yamamoto K, Yamanaka T, Ueno R, Hirayama K, Yang HG, Wang D, Nakashima H |
3387 - 3391 |
Influence of oxygen transfer in Hf-based high-k dielectrics on flatband voltage shift Nabatame T, Kimura M, Yamada H, Ohi A, Ohishi T, Chikyow T |
3392 - 3396 |
Behavior of N atoms after thermal nitridation of Si1-xGex surface Kawashima T, Sakuraba M, Tillack B, Murota J |
3397 - 3401 |
Improvement of Al2O3/Ge interfacial properties by O-2-annealing Shibayama S, Kato K, Sakashita M, Takeuchi W, Nakatsuka O, Zaima S |
3402 - 3405 |
High dielectric constant terbium oxide (Tb2O3) dielectric deposited on strained-Si:C Kao CH, Liu KC, Lee MH, Cheng SN, Huang CH, Lin WK |
3406 - 3409 |
Temperature effects on the growth and electrical properties of Er2O3 films on Ge substrates Ji T, Nie TX, Cui J, Fang ZB, Yang XJ, Fan YL, Zhong ZY, Jiang ZM |
3410 - 3414 |
Suppression of Mn segregation in Ge/Mn5Ge3 heterostructures induced by interstitial carbon Dau MT, Thanh VL, Le TG, Spiesser A, Petit M, Michez LA, Ngo TH, Vu DL, Nguyen QL, Sebban P |
3415 - 3418 |
Resistive switching characteristics of multilayered (HfO2/Al2O3)(n) n=19 thin film Tzeng WH, Zhong CW, Liu KC, Chang KM, Lin HC, Chan YC, Kuo CC, Tsai FY, Tseng MH, Chen PS, Lee HY, Chen F, Tsai MJ |
3419 - 3422 |
Influence of Al co-deposition on the crystal growth of Co-based Heusler-compound thin films on Si(111) Oki S, Yamada S, Murakami T, Miyao M, Hamaya K |