1 - 6 |
Characterization of porous silicate for ultra-low k dielectric application Liu PT, Chang TC, Hsu KC, Tseng TY, Chen LM, Wang CJ, Sze SM |
7 - 12 |
Ion plating discharges: evidence of cluster formation during metal evaporation Davison A, Wilson AD, Avelar-Batista JC, Leyland A, Matthews A, Fancey KS |
13 - 17 |
Properties of nitrogen doped silicon films deposited by low pressure chemical vapour deposition from disilane and ammonia Temple-Boyer P, Jalabert L, Couderc E, Scheid E, Fadel P, Rousset B |
18 - 24 |
Raman and photoluminescence study of magnetron sputtered amorphous carbon films Papadimitriou D, Roupakas G, Xue C, Topalidou A, Panayiotatos Y, Dimitriadis CA, Logothetidis S |
25 - 30 |
Photochemical deposition of ZnSe polycrystalline thin films and their characterization Kumaresan R, Ichimura M, Arai E |
31 - 38 |
The characteristics of interface misfit dislocations for epitaxial alpha-Fe2O3 on alpha-Al2O3(0001) Wang CM, Thevuthasan S, Gao F, McCready DE, Chambers SA |
39 - 42 |
Epitaxial yttrium growth mode on BaF2 (111) and CaF2 (111) Jacob A, Borgschulte A, Schoenes J |
43 - 55 |
ZnO/Al2O3 nanolaminates fabricated by atomic layer deposition: growth and surface roughness measurements Elam JW, Sechrist ZA, George SM |
56 - 62 |
Leakage current distribution in ultrathin oxide on silicon surface with step/terrace structures Murata M, Tokuda N, Hojo D, Yamabe K |
63 - 71 |
Frictional contact analysis of scratch test for elastic and elastic-plastic thin-coating/substrate materials Jiang XY, Lauke B, Schueller T |
72 - 77 |
Supramolecular interaction of diamino calix[4]arene derivative with nucleotides at the air-water interface Liu F, Lu GY, He WJ, Liu MH, Zhu LG |
78 - 90 |
Three-dimensional wafer-scale copper chemical-mechanical planarization model Thakurta DG, Schwendeman DW, Gutmann RJ, Shankar S, Jiang L, Gill WN |
91 - 98 |
A new systematic method of characterization for the strength of thin films on substrates - evaluation of mechanical properties by means of'film projection' Kamiya S, Kimura H, Yamanobe K, Saka M, Abe H |
99 - 104 |
Measurement of the elastic and viscoelastic properties of dielectric films used in microelectronics Carlotti G, Colpani P, Piccolo D, Santucci S, Senez V, Socino G, Verdini L |
105 - 112 |
Microstructure and electroluminescence of ZnS : Mn doped with KCl Zhai Q, Li J, Lewis JS, Waldrip KA, Jones K, Holloway PH, Davidson M, Evans N |
113 - 118 |
The structural phase transition and mechanism of abnormal temperature dependence of conductivity in ZnTe : Cu polycrystalline thin films Zhang JQ, Feng LH, Cai W, Zheng JG, Cai YP, Li B, Wu LL, Shao Y |
119 - 122 |
The correlation between mechanical stress and magnetic properties of cobalt ultra thin films Belhi R, Mliki N, Jomni S, Ayadi M, Abdelmoula K, Gergaud P, Clugnet G, Charai A |
123 - 128 |
Raman study on Bi-Pb-Sr-Ca-Cu-O superconductor thin films grown by spray pyrolysis on several types of substrate Mejia-Garcia C, Diaz-Valdes E, Contreras-Puente G, Lopez-Lopez JL, Jergel M |
129 - 135 |
Synthesis and characterization of single and multilayer boron nitride and boron carbide thin films grown by magnetron sputtering of boron carbide Guruz MU, Dravid VP, Chung YW |
136 - 142 |
Exactly solvable model for metal-insulator-metal stepped boundary tunnel junctions Shu QQ, Jiang Y, Meng S, Lin G, Ma WG |
143 - 149 |
An in-plane anisotropic organic semiconductor based upon poly(3-hexyl thiophene) Amundson KR, Sapjeta BJ, Lovinger AJ, Bao ZN |
150 - 153 |
Effect of deposition rate on structural and electrical properties of Al films deposited on glass by electron beam evaporation Qui H, Wang FP, Wu P, Pan LQ, Li LY, Xiong LY, Tian Y |