3413 - 3419 |
Fabrication of Gold Nanostructures on a Vicinal Si(111) 7X7 Surface Using Ultrahigh-Vacuum Scanning Tunneling Microscope and a Gold-Coated Tungsten Tip Fujita D, Jiang QD, Nejoh H |
3420 - 3424 |
Characterization of Large-Area Arrays of Nanoscale Si Tips Fabricated Using Thermal-Oxidation and Wet Etching of Si Pillars Umbach CC, Weselak BW, Blakely JM, Shen Q |
3425 - 3430 |
Silicon Structures for in-Situ Characterization of Atomic-Force Microscope Probe Geometry Jarausch KF, Stark TJ, Russell PE |
3431 - 3435 |
Correlation of Raman and Optical Studies with Atomic-Force Microscopy in Porous Silicon Filios AA, Hefner SS, Tsu R |
3436 - 3444 |
Use of Multiple Analytical Techniques to Confirm Improved Optical Modeling of SnO2-F Films by Atomic-Force Microscopy and Spectroscopic Ellipsometry Athey PR, Urban FK, Holloway PH |
3445 - 3451 |
Optimal Filtering of Scanning Probe Microscope Images for Wear Analysis of Smooth Surfaces Schouterden K, Lairson BM, Azarian MH |
3452 - 3454 |
Atomic Structures of Ag2Te Studied by Scanning-Tunneling-Microscopy Ohto M, Tanaka K |
3455 - 3459 |
Emission Measurements and Simulation of Silicon Field-Emitter Arrays with Linear Planar Lenses Tang CM, Swyden TA, Thomason KA, Yadon LN, Temple D, Ball CA, Palmer WD, Mancusi JE, Vellenga D, Mcguire GE |
3460 - 3464 |
Comparative-Study of the Elastic Properties of Silicate Glass-Films Grown by Plasma-Enhanced Chemical-Vapor Carlotti G, Doucet L, Dupeux M |
3465 - 3469 |
Ammonia Nitridation of Thermal Polyoxide to Eliminate Epitaxial Ambient Induced Dielectric Pinhole Formation Fultz WW, Neudeck GW |
3470 - 3472 |
Selective Dry-Etching of Oxide-Films for Spacer Applications in a High-Density Plasma Allen LR, Yuwang V, Sato M |
3473 - 3482 |
Polysilicon Gate Etching in High-Density Plasmas .4. Comparison of Photoresist and Oxide Masked Polysilicon Etching-Thickness Determination of Gate Oxide Layers Using X-Ray Photoelectron-Spectroscopy Bell FH, Joubert O |
3483 - 3488 |
Electron-Beam/Ultraviolet Hybrid Exposure Combined with Novel Bilayer Resist System for a 0.15-Mu-M T-Shaped Gate Fabrication Process Takano H, Nakano H, Minami H, Hosogi K, Yoshida N, Sato K, Hirose Y, Tsubouchi N |
3489 - 3491 |
Ag2Te/As2S3 - A High-Contrast, Top-Surface Imaging Resist for 193 nm Lithography Lavine JM, Buliszak MJ |
3492 - 3496 |
Neutral Shadowing in Circular Cylindrical Trench Holes Abrahamshrauner B, Chen WJ |
3497 - 3501 |
Process Technology for Monolithic High-Speed Schottky/Resonant Tunneling Diode Logic Integrated-Circuits Lei PM, Subramaniam S, Bernstein GH, Williamson W, Gilbert BK, Chow DH |
3502 - 3508 |
Effect of the Ti/Tin Bilayer Barrier and Its Surface-Treatment on the Reliability of a Ti/Tin/Alsicu/Tin Contact Metallization Ouellet L, Tremblay Y, Gagnon G, Caron M, Currie JF, Gujrathi SC, Biberger M |
3509 - 3513 |
High-Stability Heterojunction Bipolar-Transistors with Carbon-Doped Base Grown by Atomic Layer Chemical Beam Epitaxy Driad R, Alexandre F, Juhel M, Launay P |
3514 - 3519 |
Electrical and Microstructure Analysis of Ohmic Contacts to P-Type and N-Type GaSb, Grown by Molecular-Beam Epitaxy Vogt A, Hartnagel HL, Miehe G, Fuess H, Schmitz J |
3520 - 3522 |
Thermal-Stability of W, WSix, and Ti/Al Ohmic Contacts to Ingan, Inn, and Inaln Vartuli CB, Pearton SJ, Abernathy CR, Mackenzie JD, Shul RJ, Zolper JC, Lovejoy ML, Baca AG, Hagerottcrawford M |
3523 - 3531 |
High-Temperature Surface Degradation of III-V Nitrides Vartuli CB, Pearton SJ, Abernathy CR, Mackenzie JD, Lambers ES, Zolper JC |
3532 - 3542 |
Thermal-Stability and Desorption of Group-III Nitrides Prepared by Metal-Organic Chemical-Vapor-Deposition Ambacher O, Brandt MS, Dimitrov R, Metzger T, Stutzmann M, Fischer RA, Miehr A, Bergmaier A, Dollinger G |
3543 - 3549 |
Thermally Stable InGaP/GaAs Schottky Contacts Using Low N Content Double-Layer Wsin Shiojima K, Nishimura K, Tokumitsu M, Nittono T, Sugawara H, Hyuga F |
3550 - 3554 |
Improved Cathodoluminescence Properties of GaAs/Al0.3Ga0.7As Tilted T-Shaped Quantum Wires Fabricated on (111)B Facet by Glancing-Angle Molecular-Beam Epitaxy Tomita N, Tanaka M, Saeki T, Shimomura S, Hiyamizu S, Fujita K, Watanabe T, Higuchi T, Sano N, Adachi A |
3555 - 3558 |
Quasi-Periodic Microfacets on the Surface of AlGaAs/GaAs Quantum-Well Structures Grown by Molecular-Beam Epitaxy on (311)A High-Index Substrates Freire SL, Cury LA, Matinaga FM, Valadares EC, Moreira MV, Deoliveira AG, Alves AR, Vilela JM, Andrade MS, Lima TM, Sluss JA |
3559 - 3562 |
Layer-by-Layer Removal of GaAs(110) by Bromine Cha CY, Weaver JH |
3563 - 3574 |
Treatment of InP Surfaces in Radio-Frequency H-2 and H-2/CH4/Ar Plasmas - In-Situ Compositional Analysis, Etch Rates, and Surface-Roughness Parmeter JE, Shul RJ, Howard AJ, Miller PA |
3575 - 3581 |
Annihilation of Monolayer Holes on Molecular-Beam Epitaxy-Grown GaAs Surface During Annealing as Shown by in-Situ Scanning Electron-Microscopy Inoue N, Morimoto K, Araki T, Ito T, Homma Y, Osaka J |
3582 - 3587 |
Antimony Doped GaAs - A Model of Dominant Current Transport Mechanism Valcheva E, Paskova T, Yakimova R |
3588 - 3592 |
Misfit Dislocations in Strained InxGa(1-X)as Heterostructure on Patterned GaAs(001) Substrate Zeng W, Jiang SS, Ferrari C, Gennari S, Salviati G, Jiang JH |
3593 - 3595 |
Surface Roughness-Induced Artifacts in Secondary-Ion Mass-Spectrometry Depth Profiling and a Simple Technique to Smooth the Surface Herner SB, Gila BP, Jones KS, Gossmann HJ, Poate JM, Luftman HS |
3596 - 3598 |
Rh/N-GaAs Contacts with and Without Sulfur Passivation Eftekhari G |
3599 - 3602 |
Hydrogen-Induced Reconstruction of the Gap(001) Surface Studied by Scanning-Tunneling-Microscopy Watanabe A, Shimaya H, Naitoh M, Nishigaki S |
3603 - 3603 |
Selective Wet Etching of Lattice-Matched InGaAs/InAlAs on InP and Metamorphic InGaAs/InAlAs on GaAs Using Succinic Acid Hydrogen-Peroxide Solution (Vol 14, Pg 3400, 1996) Fourre H, Diette F, Cappy A |
3604 - 3604 |
Surface-Reaction of Trimethylgallium on GaAs (Vol 14, Pg 136, 1996) Nishizawa J, Sakuraba H, Kurabayashi T |
3605 - 3605 |
Deep-Etch Silicon mm-Wave-Guide Structure for the Relativistic Acceleration of Electrons (Vol 14, Pg 2524, 1996) Willke TL, Feinerman AD |
3619 - 3619 |
Papers from the 40th International-Conference on Electron, Ion, and Photon-Beam Technology and Nanofabrication 28-31 May 1996, Atlanta Marriott Marquis, Atlanta, Georgia - Preface Pang SW |
3620 - 3624 |
Persistence Pays Off - Sir Oatley,Charles and the Scanning Electron-Microscope Everhart TE |
3625 - 3631 |
Application of Scanning Probe Methods for Electronic and Magnetic Device Fabrication, Characterization, and Testing Born A, Hahn C, Lohndorf M, Wadas A, Witt C, Wiesendanger R |
3632 - 3636 |
Low-Energy Ion Damage in Semiconductors - A Progress Report Hu EL, Chen CH, Green DL |
3637 - 3640 |
Etching Processes for Fabrication of GaN/Ingan/AlN Microdisk Laser Structures Lee JW, Vartuli CB, Abernathy CR, Mackenzie JD, Mileham JR, Pearton SJ, Shul RJ, Zolper JC, Hagerottcrawford M, Zavada JM, Wilson RG, Schwartz RN |
3641 - 3645 |
Quantum Dots Fabricated in InP/InGaAs by Free Cl-2 Gas Etching and Metalorganic Chemical-Vapor-Deposition Regrowth Panepucci R, Reuter E, Fay P, Youtsey C, Kluender J, Caneau C, Coleman JJ, Bishop SG, Adesida I |
3646 - 3649 |
Reduced Nonradiative Recombination in Etched/Regrown AlGaAs/GaAs Structures Fabricated by in-Situ Kohmoto S, Nambu Y, Asaka K, Ishikawa T |
3650 - 3653 |
Etch-Mask of Pyrolytic-Photoresist Thin-Film for Self-Aligned Fabrication of Smooth and Deep Faceted 3-Dimensional Microstructures Porkolab GA, Hsu SH, Hryniewicz JV, Lin WH, Chen YJ, Agarwala S, Johnson FG, King O, Dagenais M, Stone DR |
3654 - 3657 |
Photoluminescence Blueshift Induced by Reactive Ion Etching of Strained Cdznse/ZnSe Quantum-Well Structures Sparing LM, Wang PD, Xin SH, Short SW, Shi SS, Furdyna JK, Merz JL, Snider GL |
3658 - 3662 |
Dry-Etching Damage in III-V Semiconductors Murad S, Rahman M, Johnson N, Thoms S, Beaumont SP, Wilkinson CD |
3663 - 3667 |
Effects of Etch-Induced Damage on the Electrical Characteristics of Inplane Gated Quantum-Wire Transistors Ko KK, Berg EW, Pang SW |
3668 - 3673 |
Effects of O-2 Addition to Sicl4/Sif4 and the Thickness of the Capping Layer on Gate Recess Etching of GaAs-Pseudomorphic High-Electron-Mobility Transistors Murad SK, Cameron NI, Beaumont SP, Wilkinson CD |
3674 - 3678 |
Investigation of Improved Regrown Material on InP Surfaces Etched with Methane/Hydrogen/Argon Yu DG, Chen CH, Keller BP, Holmes AL, Hu EL, Denbaars SP |
3679 - 3683 |
Reactive Ion Etch-Induced Effects on 0.2-Mu-M T-Gate In0.52Al0.48As/In0.53Ga0.47As/InP High-Electron-Mobility Transistors Cheung R, Patrick W, Pfund I, Hahner G |
3684 - 3687 |
Photoluminescence Studies on Radiation-Enhanced Diffusion of Dry-Etch Damage in GaAs and InP Materials Chen CH, Yu DG, Hu EL, Petroff PM |
3688 - 3691 |
Suppression of Electron Shading Effect by a Counter Radio-Frequency Bias in Plasma-Etching Kamata T, Arimoto H |
3692 - 3696 |
Fabrication of Micromechanical Switches for Routing Radio-Frequency Signals Randall JN, Goldsmith C, Denniston D, Lin TH |
3697 - 3701 |
Sharpening Si Field Emitter Tips by Dry-Etching and Low-Temperature Plasma Oxidation Rakhshandehroo MR, Pang SW |
3702 - 3705 |
Realization of Atomic Layer Etching of Silicon Athavale SD, Economou DJ |
3706 - 3708 |
Precision Optical Aspheres for Extreme-Ultraviolet Lithography Kania DR, Gaines DP, Sweeney DS, Sommargren GE, Lafontaine B, Vernon SP, Tichenor DA, Bjorkholm JE, Zernike F, Kestner RN |
3709 - 3713 |
Effects of Compaction on 193 nm Lithographic System Performance Schenker R, Oldham W |
3714 - 3718 |
Merit Functions for Lithographic Lens Design Progler CJ, Byrne DM |
3719 - 3723 |
Attenuated Phase-Shift Mask Materials for 248 and 193 nm Lithography Smith BW, Butt S, Alam Z, Kurinec S, Lane RL |
3724 - 3729 |
Propagation Effects of Partial Coherence in Optical Lithography Socha RJ, Neureuther AR |
3730 - 3733 |
General Aspheric Refractive Microoptics Fabricated by Optical Lithography Using a High-Energy Beam Sensitive Glass Gray-Level Mask Daschner W, Long P, Stein R, Wu C, Lee SH |
3734 - 3737 |
Simulation of Light-Propagation in Optical Linear and Nonlinear Resist Layers by Finite-Difference Beam-Propagation and Other Methods Erdmann A, Henke W |
3738 - 3741 |
Micro-Objective Lens with Compact Secondary-Electron Detector for Miniature Low-Voltage Electron-Beam Systems Liu W, Ambe T, Pease RF |
3742 - 3746 |
Triangular-Variable-Shaped Beams Using the Cell Projection Method Someda Y, Shoda Y, Saitou N |
3747 - 3752 |
Combined Calculation of Lens Aberrations, Space-Charge Aberrations, and Statistical Coulomb Effects in Charged-Particle Optical-Columns Jiang XR, Barth JE, Kruit P |
3753 - 3758 |
Optical Design of a Combined Ion and Electron-Beam System for Nanotechnology Dejager PW, Kruit P |
3759 - 3763 |
Fundamental Limits to Imaging Resolution for Focused Ion-Beams Orloff J, Swanson LW, Utlaut M |
3764 - 3769 |
High Emittance Electron-Gun for Projection Lithography Devore W, Berger SD |
3770 - 3773 |
Ultralow Voltage Imaging Hordon LS, Monahan KM |
3774 - 3781 |
Electron-Beam Microcolumns for Lithography and Related Applications Chang TH, Thomson MG, Kratschmer E, Kim HS, Yu ML, Lee KY, Rishton SA, Hussey BW, Zolgharnain S |
3782 - 3786 |
Semiconductor on Glass Photocathodes as High-Performance Sources for Parallel Electron-Beam Lithography Schneider JE, Baum AW, Winograd GI, Pease RF, Mccord M, Spicer WE, Costello KA, Aebi VW |
3787 - 3791 |
Titanium Nitride Coated Tungsten Cold Field-Emission Sources Lo WK, Parthasarathy G, Lo CW, Tanenbaum DM, Craighead HG, Isaacson MS |
3792 - 3796 |
Experimental Evaluation of a 20X20 mm Footprint Microcolumn Kratschmer E, Kim HS, Thomson MG, Lee KY, Rishton SA, Yu ML, Zolgharnain S, Hussey BW, Chang TH |
3797 - 3801 |
Energy-Distributions of Field Emitted Electrons from Carbide Tips and Tungsten Tips with Diamond-Like Carbon Coatings Yu ML, Kim HS, Hussey BW, Chang TH, Mackie WA |
3802 - 3807 |
The Electrostatic Moving Objective Lens and Optimized Deflection Systems for Microcolumns Thomson MG |
3808 - 3812 |
Initial Images with a Partially Micromachined Scanning Electron-Microscope Crewe DA, Ruffin MM, Feinerman AD |
3813 - 3820 |
Multielectron Beam Blanking Aperture Array System Synapse-2000 Yasuda H, Arai S, Kai J, Ooae Y, Abe T, Maruyama S, Kiuchi T |
3821 - 3824 |
Characterization and Application of a Low-Profile Metal-Semiconductor-Metal Detector for Low-Energy Backscattered Electrons Meier GD, Fresser HS, Prins FE, Kern DP |
3825 - 3828 |
Preliminary-Results from a Prototype Projection Electron-Beam Stepper-Scattering with Angular Limitation Projection Electron-Beam Lithography Proof-of-Concept System Harriott LR, Berger SD, Biddick C, Blakey MI, Bowler SW, Brady K, Camarda RM, Connelly WF, Crorken A, Custy J, Dimarco R, Farrow RC, Felker JA, Fetter L, Freeman R, Hopkins L, Huggins HA, Knurek CS, Kraus JS, Liddle JA, Mkrtychan M, Novembre AE, Peabody ML, Tarascon RG, Wade HH, Waskiewicz WK, Watson GP, Werder KS, Windt D |
3829 - 3833 |
High-Resolution Electron-Beam Lithography Using Zep-520 and Krs Resists at Low-Voltage Tanenbaum DM, Lo CW, Isaacson M, Craighead HG, Rooks MJ, Lee KY, Huang WS, Chang TH |
3834 - 3838 |
Electron-Beam-Induced Damage of Silicon-Germanium Paul DJ, Ryan JM, Pepper M, Broers AN, Whall TE, Fernandez JM, Joyce BA |
3839 - 3844 |
Theory of Beam-Induced Substrate Heating Groves TR |
3845 - 3849 |
Electron-Scattering by Electron-Beam Mask with Tapered Aperture in Cell Projection Lithography Yamashita H, Ema T, Itoh K, Nozue H, Nomura E |
3850 - 3854 |
Modified Mask Methods for Pattern Accuracy Enhancement in Electron-Beam Lithography Sohda Y, Someda Y, Nakayama Y, Saitou N |
3855 - 3859 |
One-Step Electron-Beam Lithography for Multipurpose, Diffractive Optical-Elements with 200 nm Resolution Difabrizio E, Grella L, Baciocchi M, Gentili M, Peschiaroli D, Mastrogiacomo L, Maggiora R |
3860 - 3863 |
3-Dimensional Electron-Beam Lithography Using an All-Dry Resist Process Babin S, Koops HW |
3864 - 3869 |
Modeling of Electron Elastic and Inelastic-Scattering Marrian CR, Perkins FK, Park D, Dobisz EA, Peckerar MC, Rhee KW, Bass R |
3870 - 3873 |
Studies on Correction Accuracy of Proximity Effect for the Pattern Area Density Method in Electron-Beam Direct Writing Kasuga T, Konishi M, Oda T, Moriya S |
3874 - 3879 |
Region-Wise Proximity Effect Correction for Heterogeneous Substrates in Electron-Beam Lithography - Shape Modification Lee SY, Liu B |
3880 - 3886 |
Feature Contrast in Dose-Equalization Schemes Used for Electron-Beam Proximity Control Peckerar M, Marrian C, Perkins FK |
3887 - 3891 |
Electron-Beam-Induced Deposition of Copper Compound with Low-Resistivity Ochiai Y, Fujita J, Matsui S |
3892 - 3895 |
Divot Defect Repair on a Deep-Ultraviolet Sinx Half-Tone Mask Nakamura H, Komano H, Sugihara K, Koike T, Higashikawa I |
3896 - 3899 |
A Proximity Ion-Beam Lithography Process for High-Density Nanostructures Wolfe JC, Pendharkar SV, Ruchhoeft P, Sen S, Morgan MD, Horne WE, Tiberio RC, Randall JN |
3900 - 3902 |
Stencil Mask Temperature-Measurement and Control During Ion Irradiation Riordon J, Didenko L, Melngailis J |
3903 - 3906 |
Application of Optical Filters Fabricated by Masked Ion-Beam Lithography Morgan MD, Horne WE, Sundaram V, Wolfe JC, Pendharkar SV, Tiberio R |
3907 - 3910 |
High-Brightness Ion-Source for Ion Projection Lithography Guharay SK, Wang W, Dudnikov VG, Reiser M, Orloff J, Melngailis J |
3911 - 3915 |
Energy Spread in Liquid-Metal Ion Sources at Low Currents Beckman JC, Chang TH, Wagner A, Pease RF |
3916 - 3919 |
Sub-100 nm Focused Ion-Beam Lithography Using Ladder Silicone Spin-on Glass Suzuki K, Yamashita M, Kawakami N, Yoshikawa A, Nakaue A |
3920 - 3923 |
Tetramethoxysilane as a Precursor for Focused Ion-Beam and Electron-Beam Assisted Insulator (SiOx) Deposition Lipp S, Frey L, Lehrer C, Frank B, Demm E, Pauthner S, Ryssel H |
3924 - 3927 |
Hpr-506 Photoresist Used as a Positive Tone Ion Resist Bruenger WH, Buchmann LM, Torkler M, Sinkwitz S |
3928 - 3932 |
Development of Focused Ion-Beam Machining Techniques for Permalloy Structures Thaus DM, Stark TJ, Griffis DP, Russell PE |
3933 - 3937 |
Use of Very-Low Energy in-Situ Focused Ion-Beams for 3-Dimensional Dopant Patterning During Molecular-Beam Epitaxial-Growth Sazio PJ, Thompson JH, Jones GA, Linfield EH, Ritchie DA, Houlton M, Smith GW |
3938 - 3941 |
Fabrication of Laterally Selected Si Doped Layer in GaAs Using a Low-Energy Focused Ion-Beam Molecular-Beam Epitaxy Combined System Yanagisawa J, Nakayama H, Wakaya F, Yuba Y, Gamo K |
3942 - 3946 |
Focused Ion-Beam Biased Repair of Conventional and Phase-Shift Masks Cui Z, Prewett PD, Watson JG |
3947 - 3950 |
Development of Ion Sources for Ion Projection Lithography Lee Y, Gough RA, Kunkel WB, Leung KN, Perkins LT, Pickard DS, Sun L, Vujic J, Williams MD |
3951 - 3954 |
Nanofabrication Technology by Gas Cluster Ion-Beams Matsuo J, Toyoda N, Yamada I |
3955 - 3959 |
Atmospheric Metrology Using the Air Turbulence Compensated Interferometer Henshaw PD, Degloria DP |
3960 - 3963 |
Absolute Distance Measurement Interferometry for Alignment Systems for Advanced Lithography Tools Dunn TJ, Lee TM, Jain K |
3964 - 3968 |
Initial Results from an Extreme-Ultraviolet Interferometer Operating with a Compact Laser-Plasma Source Raychaudhuri AK, Krenz KD, Nissen RP, Haney SJ, Fields CH, Sweatt WC, Macdowell AA |
3969 - 3973 |
Simultaneous Measurement of Gap and Superposition in a Precision Aligner for X-Ray Nanolithography Moon EE, Everett PN, Rhee K, Smith HI |
3974 - 3979 |
Latent Image-Formation - Nanoscale Topography and Calorimetric Measurements in Chemically Amplified Resists Ocola LE, Fryer D, Nealey P, Depablo J, Cerrina F, Kammer S |
3980 - 3984 |
Minimizing Alignment Error Induced by Asymmetric Resist Coating Chen X, Pease RF |
3985 - 3989 |
Patterning Accuracy Estimation During Stage Acceleration in the Electron-Beam Direct Writing System Ex-8D Hattori K, Magoshi S, Ando A, Satoh S, Sunaoshi H, Suenaga M, Housai H, Hashimoto S, Wada H, Sugihara K |
3990 - 3995 |
Characterization of Resist Profiles Using Water Enhanced Focused Ion-Beam Micromachining Stark TJ, Griffis DP, Russell PE |
3996 - 3999 |
Investigations on the Topology of Structures Milled and Etched by Focused Ion-Beams Lipp S, Frey L, Lehrer C, Frank B, Demm E, Ryssel H |
4000 - 4003 |
Direct Aerial Image Measurements to Evaluate the Performance of an Extreme-Ultraviolet Projection Lithography System Fields CH, Oldham WG, Raychaudhuri AK, Krenz KD, Stulen RH |
4004 - 4008 |
Atomic-Force Microscopy for Cross-Section Inspection and Metrology Wilder K, Quate CF, Singh B, Alvis R, Arnold WH |
4009 - 4013 |
Analysis of Distortion in Interferometric Lithography Ferrera J, Schattenburg ML, Smith HI |
4014 - 4019 |
Effects of Electron-Beam Parameters on Critical-Dimension Measurements Mizuno F, Satoh O |
4020 - 4023 |
0.1-Mu-M Complementary Metal-Oxide-Semiconductors and Beyond Toriumi A |
4024 - 4028 |
Fabrication of Back-Gated Complementary Metal-Oxide-Semiconductor Devices Using Mixed and Matched Optical and X-Ray Lithographies Yang IY, Antoniadis DA, Smith HI |
4029 - 4033 |
A New High-Performance Surface-Micromachined Tunneling Accelerometer Fabricated Using Nanolithography Kubena RL, Atkinson GM, Robinson WP, Stratton FP |
4034 - 4037 |
Metal-Based Single-Electron Transistors Operating at Several Kelvin Altmeyer S, Hamidi A, Spangenberg B, Kurz H |
4038 - 4041 |
Fabrication of Lateral Resonant-Tunneling Devices with Heterostructure Barriers Randall JN, Broekaert TP, Smith BD, Beamlll EA, Seabaugh AC, Jovanovic D |
4042 - 4045 |
A Triangle-Shaped Nanoscale Metal-Oxide-Semiconductor Device Gondermann J, Rower T, Hadam B, Koster T, Stein J, Spangenberg B, Roskos H, Kurz H |
4046 - 4050 |
Charge Detector Realization for AlGaAs/GaAs Quantum-Dot Cellular-Automata Bazan G, Orlov AO, Snider GL, Bernstein GH |
4051 - 4054 |
A Heavy-Ion Implanted Pocket 0.10-Mu-M N-Type Metal-Oxide-Semiconductor Field-Effect Transistor with Hybrid Lithography (Electron-Beam/Deep Ultraviolet) and Specific Gate Passivation Process Benistant F, Tedesco S, Guegan G, Martin F, Heitzmann M, Dalzotto B |
4055 - 4057 |
Fabrication and Performance of Thin Amorphous Si Subwavelength Transmission Grating for Controlling Vertical-Cavity Surface-Emitting Laser Polarization Zhuang L, Schablitsky S, Shi RC, Chou SY |
4058 - 4061 |
Fabrication and Investigation of Nanostructures and Their Application in New Laser Devices Griesinger UA, Kronmuller S, Geiger M, Ottenwalder D, Scholz F, Schweizer H |
4062 - 4067 |
Fabrication of Quantum Nanostructures for the Measurement of Thermoelectric Phenomena Hannan M, Grundbacher R, Adesida I, Giannetta RW |
4068 - 4071 |
Fabrication of Si Double-Barrier Structure Yuki K, Hirai Y, Morimoto K, Morita K, Uenoyama T |
4072 - 4075 |
Limit of Resolution of a Standing-Wave Atom Optical Lens Behringer RE, Natarajan V, Timp G, Tennant DM |
4076 - 4079 |
Fabrication of a Refractive Microlens Integrated Onto the Monomode Fiber Babin S, Weber M, Koops HW |
4080 - 4084 |
Controlling Sidewall Smoothness for Micromachined Si Mirrors and Lenses Juan WH, Pang SW |
4085 - 4090 |
High-Resolution Silicon Patterning with Self-Assembled Monolayer Resists Lercel MJ, Whelan CS, Craighead HG, Seshadri K, Allara DL |
4091 - 4095 |
Fabrication of InP-Based Wavelength-Division Multiplexing Arrayed-Wave-Guide Filters Using Chemically Assisted Ion-Beam Etching Youtsey C, Adesida I, Soole JB, Amersfoort MR, Leblanc HP, Andreadakis NC, Rajhel A, Caneau C, Koza MA, Bhat R |
4096 - 4099 |
Fabrication of Subwavelength, Binary, Antireflection Surface-Relief Structures in the Near-Infrared Wendt JR, Vawter GA, Smith RE, Warren ME |
4100 - 4104 |
Combined Method of Electron-Beam Lithography and Ion-Implantation Techniques for the Fabrication of High-Temperature Superconductor Josephson-Junctions Hollkott J, Hu S, Becker C, Auge J, Spangenberg B, Kurz H |
4105 - 4109 |
Conductive Dots, Wires, and Supertips for Field Electron Emitters Produced by Electron-Beam-Induced Deposition on Samples Having Increased Temperature Koops HW, Schossler C, Kaya A, Weber M |
4110 - 4114 |
Lithographic Band-Gap Tuning in Photonic Band-Gap Crystals Cheng CC, Scherer A, Arbetengels V, Yablonovitch E |
4115 - 4118 |
Reliable Fabrication of Sub-40 nm Period Gratings Using a Nanolithography System with Interferometric Dynamic Focus Control Cumming DR, Thomas S, Beaumont SP, Weaver JM |
4119 - 4123 |
Dry-Etching of Horizontal Distributed-Bragg-Reflector Mirrors for Wave-Guide Lasers Thomas S, Pang SW |
4124 - 4128 |
Mold-Assisted Nanolithography - A Process for Reliable Pattern Replication Haisma J, Verheijen M, Vandenheuvel K, Vandenberg J |
4129 - 4133 |
Nanoimprint Lithography Chou SY, Krauss PR, Renstrom PJ |
4134 - 4139 |
Fabrication of Nanostructures on Silicon Surfaces on Wafer-Scale by Controlling Self-Organization Processes Ogino T, Hibino H, Prabhakaran K |
4140 - 4143 |
Nanoscale Patterning of an Organosilane Monolayer on the Basis of Tip-Induced Electrochemistry in Atomic-Force Microscopy Sugimura H, Okiguchi K, Nakagiri N, Miyashita M |
4144 - 4147 |
The Nanoscilloscope - Combined Topography and AC Field Probing with a Micromachined Tip Vanderweide DW, Neuzil P |
4148 - 4152 |
3-Dimensional Electron-Optical Modeling of Scanning Tunneling Microscope Lithography in Resists Dobisz EA, Koops HW, Perkins FK, Marrian CR, Brandow SL |
4153 - 4156 |
Silicon Metal-Oxide-Semiconductor Field-Effect Transistor with Gate Structures Defined by Scanned Probe Lithography Hagedom MS, Litfin DD, Price GM, Gordon AE, Higman TK |
4157 - 4161 |
How Practical Is 193 nm Lithography Rothschild M, Burns JA, Cann SG, Forte AR, Keast CL, Kunz RR, Palmateer SC, Sedlacek JH, Uttaro R, Grenville A, Corliss D |
4162 - 4166 |
Can Synthetic-Aperture Techniques Be Applied to Optical Lithography Fukuda H, Vonbunau RM |
4167 - 4170 |
Large-Area Achromatic Interferometric Lithography for 100 nm Period Gratings and Grids Savas TA, Schattenburg ML, Carter JM, Smith HI |
4171 - 4174 |
Experimental and Simulated Estimation of New Super Resolution Technique Kamon K, Matsui Y |
4175 - 4178 |
Characterization and Correction of Optical Proximity Effects in Deep-Ultraviolet Lithography Using Behavior Modeling Yen A, Tritchkov A, Stirniman JP, Vandenberghe G, Jonckheere R, Ronse K, Vandenhove L |
4179 - 4183 |
Application of Optical Lithography for High-Aspect-Ratio Microstructures Loechel B, Demmeler R, Rothe M, Bruenger W, Fehlberg S, Gruetzner G |
4184 - 4187 |
Calorimetric Measurements of Optical-Materials for 193 nm Lithography Grenville A, Uttaro R, Sedlacek JH, Rothschild M, Corliss D |
4188 - 4192 |
Fabrication of Metal-Oxide-Semiconductor Devices with Extreme-Ultraviolet Lithography Nguyen KB, Cardinale GF, Tichenor DA, Kubiak GD, Berger K, Raychaudhuri AK, Perras Y, Haney SJ, Nissen R, Krenz K, Stulen RH, Fujioka H, Hu C, Bokor J, Tennant DM, Fetter LA |
4193 - 4198 |
Study on Elliptic Polarization Illumination Effects for Microlithography Jeon SH, Cho BD, Lee KW, Lee SM, Baik KH, Ahn CN, Yim DG |
4199 - 4202 |
Passivate Sinx Half-Tone Phase-Shifting Mask for Deep-Ultraviolet Exposure Ito S, Iwamatsu T, Sato H, Asano M, Kawano K, Miyashita F |
4203 - 4206 |
Prospect and Challenges of ArF Excimer-Laser Lithography Processes and Materials Ohfuji T, Ogawa T, Kuhara K, Sasago M |
4207 - 4211 |
Plasma-Deposited Silylation Resist for 193 nm Lithography Horn MW, Maxwell BE, Goodman RB, Kunz RR, Eriksen LM |
4212 - 4215 |
ArF Surface Modification Resist Process with Enhanced Water Sorption Ability Matsuo T, Endo M, Shirai M, Tsunooka M |
4216 - 4220 |
Acid-Diffusion Suppression in Chemical Amplification Resists by Controlling Acid-Diffusion Channels in Base Matrix Polymers Yoshimura T, Shiraishi H, Terasawa T, Okazaki S |
4221 - 4225 |
Diagnostics of Patterning Mechanisms in Chemically Amplified Resists from Bake Dependencies of Images Zuniga MA, Neureuther AR |
4226 - 4228 |
A Study of Acid Diffusion in Chemically Amplified Deep-Ultraviolet Resist Itani T, Yoshino H, Hashimoto S, Yamana M, Samoto N, Kasama K |
4229 - 4233 |
Multilayer Inorganic Antireflective System for Use in 248 nm Deep-Ultraviolet Lithography Cirelli RA, Weber GR, Kornblit A, Baker RM, Klemens FP, Demarco J, Pai CS |
4234 - 4238 |
Effect of Gaseous Permeability of Overcoat Layer on KrF Chemically Amplified Positive Resists Kishimura S, Sakai J, Tsujita K, Matsui Y |
4239 - 4245 |
Resist Application Effects on Chemically Amplified Resist Response Dentinger PM, Nelson CM, Rhyner SJ, Taylor JW, Fedynyshyn TH, Cronin MF |
4246 - 4251 |
Impact of Reduced Resist Thickness on Deep-Ultraviolet Lithography Azuma T, Ohiwa T, Okumura K, Farrell T, Nunes R, Dobuzinsky D, Fichtl G, Gutmann A |
4252 - 4256 |
Application of a Reaction-Diffusion Model for Negative Chemically Amplified Resists to Determine Electron-Beam Proximity Correction Parameters Glezos N, Patsis GP, Raptis I, Argitis P, Gentili M, Grella L |
4257 - 4261 |
Negative Resist Corner Rounding - Envelope Volume Modeling Hagouel PI, Neureuther AR, Zenk AM |
4262 - 4266 |
Electron-Beam-Induced Etching of Resist with Water-Vapor as the Etching Medium Kohlmannvonplaten KT, Bruenger WH |
4267 - 4271 |
Correlation of Uviihs Resist Chemistry to Dissolution Rate Measurements Thackeray J, Fedynyshyn TH, Kang D, Rajaratnam MM, Wallraff G, Opitz J, Hofer D |
4272 - 4276 |
Nanometer-Scale Resolution of Calixarene Negative Resist in Electron-Beam Lithography Fujita J, Ohnishi Y, Ochiai Y, Nomura E, Matsui S |
4277 - 4282 |
Measurement of the Backscatter Coefficient Using Resist Response Curves for 20-100 keV Electron-Beam Lithography on Si Watson GP, Fu D, Berger SD, Tennant D, Fetter L, Novembre A, Biddick C |
4283 - 4287 |
High-Voltage Electron-Beam Nanolithography on WO3 Carcenac F, Vieu C, Haghirigosnet AM, Simon G, Mejias M, Launois H |
4288 - 4293 |
Extendibility of X-Ray-Lithography to Less-Than-or-Equal-to-130 nm Ground Rules in Complex Integrated-Circuit Patterns Hector S, Chu W, Thompson M, Pol V, Dauksher B, Cummings K, Resnick D, Pendharkar S, Maldonado J, Mccord M, Krasnoperova A, Liebmann L, Silverman J, Guo J, Khan M, Bollepalli S, Capodieci L, Cerrina F |
4294 - 4297 |
Extendibility of Synchrotron-Radiation Lithography to the Sub-100 nm Region Deguchi K, Miyoshi K, Oda M, Matsuda T, Ozawa A, Yoshihara H |
4298 - 4302 |
Replication of Near 0.1-Mu-M Hole Patterns by Using X-Ray-Lithography Kikuchi Y, Kihara N, Sugihara S, Saitoh S, Kondo K, Nomura H, Ozaki T |
4303 - 4307 |
Overlay Accuracy of Canon Synchrotron-Radiation Stepper Xfpa for 0.15-Mu-M Process Saitoh K, Ohsawa H, Sentoku K, Matsumoto T, Mizusawa N, Fukuda Y, Uda K, Sumitani H, Hifumi T |
4308 - 4313 |
Predicting Inplane Distortion from Electron-Beam Lithography on X-Ray Mask Membranes Laird DL, Engelstad RL, Puisto DM, Acosta RE, Cummings KD, Johnson WA |
4314 - 4317 |
Trench Isolation at 300 nm Active Pitch Using X-Ray-Lithography Perera AH, Thompson M, Hector S, Iyer S, Azrak MJ, Zavala M |
4318 - 4322 |
A Proposal for Maskless, Zone-Plate-Array Nanolithography Smith HI |
4323 - 4327 |
Optimization of the Refractory X-Ray Mask Fabrication Sequence Cummings KD, Dauksher WJ, Johnson WA, Laudon MF, Engelstad R |
4328 - 4331 |
Defect-Free X-Ray Masks for 0.2-Mu-M Large-Scale Integrated-Circuits Okada I, Saitoh Y, Sekimoto M, Ohkubo T, Matsuda T |
4332 - 4335 |
X-Ray Mask Distortion Correction Technology Using Pattern Displacement Simulator Uchiyama S, Oda M, Matsuda T |
4336 - 4340 |
X-Ray-Induced Mask Contamination and Particulate Monitoring in X-Ray Steppers Capasso C, Pomerene A, Chu W, Leavey J, Lamberti A, Hector S, Oberschmidt J, Pol V |
4341 - 4344 |
Multiple-Pass Writing Optimization for Proximity X-Ray Mask-Making Using Electron-Beam Lithography Puisto DM, Lawliss MS, Rocque JM, Kimmel KR, Hartley JG |
4345 - 4349 |
Fabrication of X-Ray-Lithography Masks with Optical Lithography Latulipe D, Maldonado JR, Mitchell P, Leduc R, Babich I |
4350 - 4353 |
Dynamic Motion of Mask Membrane in X-Ray Stepper Uchida N, Kikuiri N, Nishida J |
4354 - 4358 |
Image Placement Errors in X-Ray Masks Induced by Changes in Resist Stress During Electron-Beam Writing Acosta RE, Puisto D |
4359 - 4362 |
Fabrication of X-Ray Masks for Giga-Bit DRAM by Using a SiC Membrane and W-Ti Absorber Marumoto K, Yabe H, Aya S, Kitamura K, Sasaki K, Kise K, Miyachi T |
4363 - 4365 |
Sputtered Tax Film Properties for X-Ray Mask Absorbers Yoshihara T, Kotsuji S, Suzuki K |
4366 - 4370 |
X-Ray Mask Fabrication Technology for 0.1-Mu-M Very Large-Scale Integrated-Circuits Oda M, Uchiyama S, Watanabe T, Komatsu K, Matsuda T |