1773 - 1776 |
Strain-induced birefringence in Si1-xGex optical waveguides Robillard M, Jessop PE, Bruce DM, Janz S, Williams RL, Mailhot S, Lafontaine H, Kovacic SJ, Ojha JJ |
1777 - 1785 |
Relaxation of strained, epitaxial Si1-xSnx Fyhn MF, Chevallier J, Larsen AN |
1786 - 1789 |
Layer by layer growth mode stabilization and step-edge smoothing of cation-stabilized In1-xGaxAs strained layers grown on InP Robach Y, Solere A, Gendry M, Porte L |
1790 - 1793 |
Reduced 980 nm laser facet absorption by band gap shifted extended cavities Piva PG, Goldberg RD, Mitchell IV, Fafard S, Dion M, Buchanan M, Charbonneau S, Hillier G, Miner C |
1794 - 1803 |
Localized interface states and the optical spectra of AlSb/InAs heterostructures Shaw MJ, Gopir G, Briddon PR, Jaros M |
1804 - 1807 |
Chemical beam epitaxial growth of GaAs1-xPx on GaAs (100) substrates Wildt D, Garcia BJ, Castano JL, Piqueras J, Pastor CJ |
1808 - 1811 |
Effect of a deep-level trap on hole transport in In0.5Al0.5As/In0.5Ga0.5As metal-semiconductor-metal photodetectors Lee KJ, Johnson FG, Johnson WB, Kim J, Lee CH |
1812 - 1817 |
Effect of the forward biasing the source-substrate junction in n-metal-oxide-semiconductor transistors for possible low power complementary metal-oxide-semiconductor integrated circuits' applications De la Hidalga FJ, Deen MJ, Gutierrez EA, Balestra F |
1818 - 1822 |
Reduced damage reactive ion etching process for fabrication of InGaAsP/InGaAs multiple quantum well ridge waveguide lasers Qiu BC, Ooi BS, Bryce AC, Hicks SE, Wilkinson CDW, De la Rue RM, Marsh JH |
1823 - 1832 |
X-ray photoelectron spectroscopy damage characterization of reactively ion etched InP in CH4-H-2 plasmas Feurprier Y, Cardinaud C, Turban G |
1833 - 1840 |
Germanium etching in high density plasmas for 0.18 mu m complementary metal-oxide-semiconductor gate patterning applications Monget C, Schiltz A, Joubert O, Vallier L, Guillermet M, Tormen B |
1841 - 1845 |
Estimation of the activation energy for Ar/Cl-2 plasma etching of InP via holes using electron cyclotron resonance Sabin EW |
1846 - 1850 |
Abrupt reduction in poly-Si etch rate in HBr/O-2 plasma Kuroda S, Iwakuro H |
1851 - 1859 |
Structural, optical, and electrical properties of nanocrystalline silicon films deposited by hydrogen plasma sputtering Garrido B, Perez-Rodriguez A, Morante JR, Achiq A, Gourbilleau F, Madelon R, Rizk R |
1860 - 1863 |
Deep, vertical etching of flame hydrolysis deposited hi-silica glass films for optoelectronic and bioelectronic applications McLaughlin AJ, Bonar JR, Jubber MG, Marques PVS, Hicks SE, Wilkinson CDW, Aitchison JS |
1864 - 1866 |
Sidewall slope control of chemically assisted ion-beam etched structures in InP-based materials Daleiden J, Czotscher K, Hoffmann C, Kiefer R, Klussmann S, Muller S, Nutsch A, Pletschen W, Weisser S, Trankle G, Braunstein J, Weimann G |
1867 - 1872 |
Evaluation of trifluoroiodomethane as SiO2 etchant for global warming reduction Fracassi F, d'Agostino R |
1873 - 1880 |
Electrical characterization and annealing behavior of defect introduced in Si during sputter etching in an Ar plasma Deenapanray PNK, Auret FD, Myburg G |
1881 - 1884 |
Low frequency noise in heavily doped polysilicon thin film resistors Deen MJ, Rumyantsev S, Orchard-Webb J |
1885 - 1890 |
Damage-free cleaning of Si(001) using glancing-angle ion bombardment Labanda JGC, Barnett SA, Hultman L |
1891 - 1893 |
Inductively coupled plasma etching of (Ba,Sr)TiO3 thin films Lee HM, Kim DC, Jo W, Kim KY |
1894 - 1900 |
Reactive ion etching of Pb(ZrxTi1-x)O-3 thin films in an inductively coupled plasma Chung CW |
1901 - 1906 |
Structural study of YSi1.7 layers formed by channeled ion beam synthesis Wu MF, Yao SD, Vantomme A, Hogg S, Pattyn H, Langouche G, Yang QQ, Wang QM |
1907 - 1913 |
Implanted gallium ion concentrations of focused-ion-beam prepared cross sections Ishitani T, Koike H, Yaguchi T, Kamino T |
1914 - 1918 |
Widely changing probability of surface damage creation induced by a single ion in the MeV ion energy range Ogiso H, Tokumoto H, Nakano S, Yamanaka K |
1919 - 1927 |
Evidence of depth and lateral diffusion of defects during focused ion beam implantation Vieu C, Gierak J, Schneider M, Ben Assayag G, Marzin JY |
1928 - 1932 |
On the improvement in thermal quenching of luminescence in SiGe/Si structures grown by molecular beam epitaxy Chen WM, Buyanova IA, Pozina G, Monemar B, Ni WX, Hansson GV |
1933 - 1936 |
Changes in morphology using atomic hydrogen during Si/Si1-xGex molecular beam epitaxy growth on Si (100) Silvestre C, Jernigan GG, Twigg ME, Thompson PE |
1937 - 1942 |
Stabilizing the surface morphology of Si1-x-yGexCy/Si heterostructures grown by molecular beam epitaxy through the use of a silicon-carbide source Croke ET, Vajo JJ, Hunter AT, Ahn CC, Chandrasekhar D, Laursen T, Smith DJ, Mayer JW |
1943 - 1947 |
Low temperature scanning tunneling microscope-induced luminescence of GaN Evoy S, Harnett CK, Craighead HG, Eustis TJ, Davis WA, Murphy MJ, Schaff WJ, Eastman LF |
1948 - 1952 |
High efficiency, dual collection made near-field scanning optical microscope Stranick SJ, Richter LJ, Cavanagh RR |
1953 - 1957 |
Probing conducting particles buried in a Ni-x(SiO2)(1-x) composite by conducting atomic force microscopy Luo EZ, Wilson IH, Xu JB, Ma JX, Yan X |
1958 - 1963 |
Microroughness of polymer thin films studied by total-reflection x-ray fluorescence and atomic force microscopy Wu WL, Wallace WE |
1964 - 1970 |
Plasticity study of deformed materials by in situ atomic force microscopy Coupeau C, Girard JC, Grilhe J |
1971 - 1982 |
Secondary ion mass spectrometry and atomic force spectroscopy studies of surface roughening, erosion rate change and depth resolution in Si during 1 keV 60 degrees O-2(+) bombardment with oxygen flooding Jiang ZX, Alkemade PFA |
1983 - 1986 |
Novel approach to atomic force lithography Hu S, Altmeyer S, Hamidi A, Spangenberg B, Kurz H |
1987 - 1991 |
Dry-etching development characteristics of Se75Ge25 resist for focused-ion-beam lithography Lee HY, Chung HB |
1992 - 1997 |
Blurring effect analysis of an x-ray mask for synchrotron radiation lithography Kim IY, Kwak BM, Jeon YJ, Choi SS |
1998 - 2005 |
Photoresist erosion studied in an inductively coupled plasma reactor employing CHF3 Doemling MF, Rueger NR, Oehrlein GS, Cook JM |
2006 - 2012 |
Apparent tunnel barrier heights of Ptlr-Au interfaces in relation to the Au surface composition Boyer L, Noel S, Houze F |
2013 - 2018 |
Structural and electrical properties of chemical vapor deposition tungsten overgrowth on physical vapor deposited and metalorganic chemical vapor deposited TiN adhesion layers Peng YC, Chen LJ, Hsieh WY, Yang YR, Hsieh YF |
2019 - 2025 |
Characterization of TiN barriers against Cu diffusion by capacitance-voltage measurement Rha SK, Lee SY, Lee WJ, Hwang YS, Park CO, Kim DW, Lee YS, Whang CN |
2026 - 2033 |
Thermal stability of selective chemical vapor deposited tungsten contact and effects of in situ N-2 plasma treatment Wang MT, Wang PC, Chuang MC, Chen LJ, Chen MC |
2034 - 2037 |
Effects of sintering on Au/Ti/GaAs Schottky barrier submicron metal-semiconductor field-effect transistors characteristics Ahmed MM |
2038 - 2048 |
Advanced emitters for next generation rf amplifiers Jensen KL, Yater JE, Zaidman EG, Kodis MA, Shih A |
2049 - 2051 |
Field emission from nitrogen doped tetrahedral amorphous carbon prepared by filtered cathodic vacuum are technique Cheah LK, Shi X, Tay BK, Sun Z |
2052 - 2056 |
Field emission of nitrogen-doped diamond films Han IT, Lee N, Lee SW, Kim SH, Jeon D |
2057 - 2062 |
Field emission from ZrC and ZrC films on Mo field emitters Mackie WA, Xie TB, Matthews MR, Routh BP, Davis PR |
2063 - 2072 |
Experimental evaluation of the extended Schottky model for ZrO/W electron emission Fransen MJ, Faber JS, van Rooy TL, Tiemeijer PC, Kruit P |
2073 - 2078 |
Surface work function studies in porous silicon Bhave TM, Bhoraskar SV |
2079 - 2081 |
Computer-controlled fabrication of ultra-sharp tungsten tips Kim YG, Choi EH, Kang SO, Cho G |
2082 - 2085 |
Electrophysical characteristics and low-energy cathodoluminescence of vacuum fluorescent display and field emission display screens Bukesov SA, Nikishin NV, Dmitrienko AO, Shmakov SL, Kim JM |
2086 - 2090 |
Resistivity effect of ZnGa2O4 : Mn phosphor screen on cathodoluminescence characteristics of field emission display Kim SS, Cho SH, Yoo JS, Jo SH, Lee JD |
2091 - 2098 |
Critical role of degassing for hot aluminum filling Proost J, Kondoh E, Vereecke G, Heyns M, Maex K |
2099 - 2101 |
Analysis of scanning force microscope force-distance data beyond the Hookian approximation Zypman FR, Eppell SJ |
2102 - 2104 |
Microtrenching resulting from specular reflection during chlorine etching of silicon Hoekstra RJ, Kushner MJ, Sukharev V, Schoenborn P |
2105 - 2109 |
Aligned pipe arrays formation by silicon anodic etching dos Santos MC, Teschke O |
2110 - 2112 |
Side-by-side wafer bonding of InP for use with stepper-based lithography Ryan RW, Kopf RF, Tate A, Burm J, Hamm RA |
2113 - 2114 |
Simple technique for measuring grating periods made using e-beam lithography Feder KS, Tennant DM |
2115 - 2117 |
Electrical characteristics of Ta2O5 films on Si prepared by dc magnetron reactive sputtering and annealed rapidly in N2O Eftekhari G |
2118 - 2120 |
Tungsten silicide and tungsten polycide anisotropic dry etch process for highly controlled dimensions and profiles Bashir R, Kabir AE, Hebert F, Bracken C |
2121 - 2124 |
Perturbation solution for the interfacial oxidation of silicon Mhetar VR, Archer LA |
2125 - 2126 |
Atomic force microscopy observation of the ferroelectric domain structure on the (010) cleavage surface of K2ZnCl4 Kim DY, Hong JW, Kwun SI, Jeong SY |
2127 - 2129 |
In situ ultraviolet illumination of porous silicon during scanning tunneling microscopy Schwall D, Otter FA, Galligan JM |
2133 - 2133 |
Papers from the 25th Annual Conference on the Physics ad Chemistry of Semiconductor Interfaces - Preface Rowe JE, Feenstra RM |
2134 - 2153 |
What can electron paramagnetic resonance tell us about the Si/SiO2 system? Lenahan PM, Conley JF |
2154 - 2158 |
Interface formation and thermal stability of advanced metal gate and ultrathin gate dielectric layers Claflin B, Lucovsky G |
2159 - 2164 |
Formation of ultrathin oxynitride layers on Si(100) by low-temperature electron cyclotron resonance N2O plasma oxynitridation process Chakraborty S, Yoshida T, Hashizume T, Hasegawa H, Saki T |
2165 - 2170 |
Surface roughness of SiO2 from a remote microwave plasma enhanced chemical vapor deposition process Rack MJ, Vasileska D, Ferry DK, Sidorov M |
2171 - 2176 |
Investigation of postoxidation thermal treatments of Si/SiO2 interface in relationship to the kinetics of amorphous Si suboxide decomposition Hinds BJ, Wang F, Wolfe DM, Hinkle CL, Lucovsky G |
2177 - 2181 |
Cathodoluminescence measurements of suboxide band-tail and Si dangling bond states at ultrathin Si-SiO2 interfaces Young AP, Schafer J, Jessen GH, Bandhu R, Brillson LJ, Lucovsky G, Niimi H |
2182 - 2187 |
Effects of interface roughness and conducting filaments in metal-oxide-semiconductor tunnel structures Ting DZY, McGill TC |
2188 - 2190 |
Equilibrium shape of CoSi2 hut clusters on Si(100) Brongersma SH, Castell MR, Perovic DD, Zinke-Allmang M |
2191 - 2198 |
Heterointerface dipoles : Applications to (a) Si-SiO2, (b) nitrided Si-N-SiO2, and (c) SiC-SiO2 interfaces Lucovsky G, Yang H, Massoud HZ |
2199 - 2203 |
Multilayer oxidation of AlAs by thermal and electron beam induced decomposition of H2O in ultrahigh vacuum Yi SI, Mitchell WJ, Chung CH, Hu EL, Weinberg WH |
2204 - 2214 |
Exciton localization in InGaN quantum well devices Chichibu S, Sota T, Wada K, Nakamura S |
2215 - 2217 |
Dynamics of localized excitons in InGaN/GaN quantum wells Yu HB, Htoon H, deLozanne A, Shih CK, Grudowski PA, Dupuis RD, Zeng K, Mair R, Lin JY, Jiang HX |
2218 - 2223 |
Investigation of the chemistry and electronic properties of metal gallium nitride interfaces Wu CI, Kahn A |
2224 - 2228 |
Negative electron affinity of cesiated p-GaN(0001) surfaces Eyckeler M, Monch W, Kampen TU, Dimitrov R, Ambacher O, Stutzmann M |
2229 - 2236 |
Nucleation and growth of GaN layers on GaAs, Si, and SiC substrates Ploog KH, Brandt O, Yang H, Yang B, Trampert A |
2237 - 2241 |
Reflection high-energy electron diffraction studies of wurtzite GaN grown by molecular beam epitaxy Hughes OH, Korakakis D, Cheng TS, Blant AV, Jeffs NJ, Foxon CT |
2242 - 2249 |
Reconstructions of GaN(0001) and (0001) surfaces : Ga-rich metallic structures Smith AR, Feenstra RM, Greve DW, Shin MS, Skowronski M, Neugebauer J, Northrup JE |
2250 - 2253 |
Soft x-ray emission studies of the bulk electronic structure of AlN, GaN, and Al0.5Ga0.5N Smith KE, Duda LC, Stagarescu CB, Downes J, Korakakis D, Singh R, Moustakas TD, Guo JH, Nordgren J |
2254 - 2260 |
Formation of an Sb-N compound during nitridation of InSb (001) substrates using atomic nitrogen Haworth L, Lu J, Hill P, Westwood DI, Macdonald JE, Hartmann N, Schneider A, Zahn DRT |
2261 - 2266 |
Influence of growth conditions, inversion domains, and atomic hydrogen on growth of (0001) GaN by molecular beam epitaxy Myers TH, Hirsch LS, Romano LT, Richards-Babb MR |
2267 - 2274 |
Epitaxial growth and properties of III-V magnetic semiconductor (GaMn)As and its heterostructures Tanaka M |
2275 - 2279 |
Ferromagnetic resonance imaging of Co films using magnetic resonance force microscopy Suh BJ, Hammel PC, Zhang Z, Midzor MM, Roukes ML, Childress JR |
2280 - 2285 |
In situ controlled reactions and phase formation of thin films on GaAs Caldwell DA, Chen LC, Bensaoula AH, Farrer JK, Carter CB, Palmstrom CJ |
2286 - 2290 |
Metal/GaN Schottky barriers characterized by ballistic-electron-emission microscopy and spectroscopy Bell LD, Smith RP, McDermott BT, Gertner ER, Pittman R, Pierson RL, Sullivan GJ |
2291 - 2295 |
Ballistic electron emission microscopy spectroscopy study of AlSb and InAs/AlSb superlattice barriers Cheng XC, McGill TC |
2296 - 2301 |
Current oscillations in thin metal-oxide-semiconductor structures observed by ballistic electron emission microscopy Wen HJ, Ludeke R, Schenk A |
2302 - 2307 |
Investigation of ultrathin SiO2 film thickness variations by ballistic electron emission microscopy Kaczer B, Im HJ, Pelz JP |
2308 - 2312 |
Compliant substrate technology : Status and prospects Brown AS |
2313 - 2316 |
Interface states induced in GaAs by growth interruption during an in situ process Wakaya F, Matsubara T, Nakayama M, Yanagisawa J, Yuba Y, Takaoka S, Murase K, Gamo K |
2317 - 2323 |
Influence of sulfur interlayers on the Mg/CaAs(100) interface formation Hohenecker S, Kampen TU, Zahn DRT, Braun W |
2324 - 2327 |
Direct imaging of the evolving Au/InSb(III) B interface Mishima T, Nakamura J, Tsukada K, Nishizawa M, Eguchi T, Osaka T |
2328 - 2333 |
Microwave modulated photoluminescence used to measure surface recombination velocities Inglefield CE, DeLong MC, Taylor PC, Harrison WA |
2334 - 2341 |
Native extended defects in Zn1-yGdySe/InxGa1-xAs heterostructures Muller B, Heun S, Lantier R, Rubini S, Paggel JJ, Sorba L, Bonanni A, Lazzarino M, Bonanni B, Franciosi A, Napolitani E, Romanato F, Drigo A, Bonard JM, Ganiere JD, Lazzarini L, Salviati G |
2342 - 2349 |
In situ determination of in-plane strain anisotropy in ZnSe(001)/GaAs layers using reflectance difference spectroscopy Hingerl K, Yasuda T, Hanada T, Miwa S, Kimura K, Ohtake A, Yao T |
2350 - 2354 |
Interpretation of reflectance anisotropy spectroscopy spectra of ZnSe(001) grown on GaAs(001) in terms of bulk, interface, and surface contributions Frisch AM, Schultz C, Herrmann T, Emiliani V, Wolfframm D, Evans DA, Korn M, Rossow U, Esser N, Richter W |
2355 - 2357 |
Reflectance difference spectroscopy spectra of clean (3 x 2), (2 x 1), and c(2 x 2) 3C-SiC(001) surfaces : New evidence for surface state contributions to optical anisotropy spectra Rossow U, Lindner K, Lubbe M, Aspnes DE, Zahn DRT |
2358 - 2366 |
Processes of quantum dot formation in the InAs on GaAs(001) system : A reflectance anisotropy spectroscopy study Westwood DI, Sobiesierski Z, Matthai CC, Steimetz E, Zettler T, Richter W |
2367 - 2372 |
Photon-induced localization and final-state correlation effects in optically absorbing materials Aspnes DE, Mantese L, Bell KA, Rossow U |
2373 - 2380 |
Reflection high-energy electron diffraction scanning tunneling microscopy study of InAs growth on the three low index orientations of GaAs : Two-dimensional versus three-dimensional growth and strain relaxation Joyce BA, Jones TS, Belk JG |
2381 - 2386 |
Structure of InAs/AlSb/InAs resonant tunneling diode interfaces Nosho BZ, Weinberg WH, Zinck JJ, Shanabrook BV, Bennett BR, Whitman LJ |
2387 - 2394 |
Scanning tunneling microscopy and x-ray photoelectron spectroscopy studies of atomic level structure and Fermi level pinning on GaAs(110) surfaces grown by molecular beam epitaxy Ishikawa Y, Tsurumi N, Fukui T, Hasegawa H |
2395 - 2398 |
Atomic-scale compositional structure of InAsP/InP and InNAsP/InP heterostructures grown by molecular-beam epitaxy Zuo SL, Bi WG, Tu CW, Yu ET |
2399 - 2403 |
Chemistry of [(t-butyl)GaS](4) on Si(100)-(2x1) Pelzel RI, Hopcus AB, Owen JHG, Nosho BZ, Weinberg WH |
2404 - 2412 |
New model for reflection high-energy electron diffraction intensity oscillations Braun W, Daweritz L, Ploog KH |
2413 - 2416 |
Anisotropic microstructure development during the reaction of Mg with GaAs Robey SW |
2417 - 2420 |
Equilibrium critical thickness for strained-layer growth Khor KE, Sarma SD |
2421 - 2425 |
Surface roughness, strain, and alloy segregation in lattice-matched heteroepitaxy Priester C, Grenet G |
2426 - 2431 |
Chemical bonding features for faultily stacked interfaces of GaAs{111} Nakamura J, Mishima T, Masui MH, Sawayanagi M, Cho SP, Nishizawa M, Eguchi T, Osaka T |
2438 - 2438 |
Microelectronics and nanometer structures - Processing, measurement, and phenomena - Preface Melngailis J, Gamo K, Orloff J |
2439 - 2443 |
Material-wave nanotechnology : Nanofabrication using a de Broglie wave Matsui S, Fujita JI |
2444 - 2448 |
Economic and technical case for ion projection lithography Berry IL |
2449 - 2454 |
Microelectromechanical tunneling sensor fabrication and post-processing characterization using focused ion beams Stratton FP, Kubena RL, McNulty HH, Joyce RJ, Vajo J |
2455 - 2461 |
Multipurpose nanobeam source with supertip emitter Kalbitzer S, Knoblauch A |
2462 - 2468 |
Focused ion beam optical column design and consideration on minimum attainable beam size Sakaguchi K, Sekine T |
2469 - 2472 |
Overlay accuracy tests for direct write implantation Mogren S, Barry IL |
2473 - 2478 |
Development of ion and electron dual focused beam apparatus for high spatial resolution three-dimensional microanalysis of solid materials Cheng Z, Sakamoto T, Takahashi M, Kuramoto Y, Owari M, Nihei Y |
2479 - 2483 |
Key technologies of a focused ion beam system for single ion implantation Matsukawa T, Shinada T, Fukai T, Ohdomari I |
2484 - 2488 |
Development of wide range energy focused ion beam lithography system Kinokuni M, Sawaragi H, Mimura R, Aihara R, Forchel A |
2489 - 2493 |
Current status of single ion implantation Shinada T, Kumura Y, Okabe J, Matsukawa T, Ohdomari I |
2494 - 2498 |
Chemically and geometrically enhanced focused ion beam micromachining Russell PE, Stark TJ, Griffis DP, Phillips JR, Jarausch KF |
2499 - 2505 |
Focused ion beam technology applied to microstructure fabrication Vasile MJ, Nassar R, Xie JS |
2506 - 2510 |
Focused-ion-beam-assisted etching of diamond in XeF2 Taniguchi J, Ohno N, Takeda S, Miyamoto I, Komuro M |
2511 - 2514 |
Focused ion beam etching of resist Ni multilayer films and applications to metal island structure formation Nakayama M, Wakaya F, Yanagisawa J, Gamo K |
2515 - 2521 |
Focused ion beam direct deposition and its applications Nagamachi S, Ueda M, Ishikawa J |
2522 - 2527 |
Transmission electron microscopy observation of thin foil specimens prepared by means of a focused ion beam Saka H |
2528 - 2531 |
Dynamic Monte Carlo simulation for depth profiling by ion-sputter etching : Application to the AlAs/GaAs multilayered system Lee HI, Shimizu R |
2532 - 2537 |
Proposals for exact point transmission electron microscopy using focused ion beam specimen preparation technique Ishitani T, Taniguchi Y, Isakozawa S, Koike H, Yaguchi T, Matsumoto H, Kamino T |
2538 - 2542 |
GaAs microcrystal growth on semiconductor surfaces by low energy focused ion beam Chikyow T, Koguchi N |
2543 - 2546 |
AlGaAs/GaAs heterostructures grown on a focused-Be-ion-beam written backgate Hirayama Y, Saku T |
2547 - 2550 |
Formation of GaAs/AlGaAs constricted-channel field-effect transistor structures by focused Ga implantation and transport of electrons via focused ion beam induced localized states Kim H, Noda T, Sakaki H |
2551 - 2554 |
Hopping conduction and localized states in p-Si wires formed by focused ion beam implantations Iwano H, Zaima S, Yasuda Y |
2555 - 2561 |
End-point detection using focused ion beam-excited photoemissions in milling deep small holes in large scale integrated circuit structures Yamaguchi H, Saitoh K, Mizumura M |
2562 - 2566 |
Focused ion beam implantation for opto- and microelectronic devices Konig H, Mais N, Hofling E, Reithmaier JP, Forchel A, Mussig H, Brugger H |
2567 - 2569 |
Direct writing of active loads by focused ion beams Wiemann C, Versen M, Wieck AD |
2570 - 2573 |
In situ scanning tunneling microscope studies of high-energy, focused ion implantation of Ga into GaAs : Direct observation of ion beam profiles Jones GAC, Rose PD, Brown S |
2574 - 2577 |
Ion beam synthesis of cobalt disilicide using focused ion beam implantation Teichert J, Bischoff L, Hausmann S |