603 - 611 |
The Correlation Between the Surface-Chemistry and the Performance of Li-Carbon Intercalation Anodes for Rechargeable Rocking-Chair Type Batteries Aurbach D, Eineli Y, Chusid O, Carmeli Y, Babai M, Yamin H |
611 - 614 |
Influence of Electrolyte on Lithium Cycling Efficiency with Pressurized Electrode Stack Hirai T, Yoshimatsu I, Yamaki J |
614 - 618 |
Capacitive-Type Humidity Sensors Using Polymerized Vinyl Carboxylate Matsuguchi M, Sadaoka Y, Nuwa Y, Shinmoto M, Sakai Y, Kuroiwa T |
619 - 621 |
Rotating-Disk Studies in Molten Carbonates .1. Electrode Design Ramaswami K, Selman JR |
622 - 629 |
Rotating-Disk Studies in Molten Carbonates .2. Meniscus and Film Effects Ramaswami K, Selman JR |
629 - 635 |
Surface-Analysis and Electrochemistry of MoS2 Thin-Films Prepared by Intercalation-Exfoliation Techniques Santiago Y, Cabrera CR |
636 - 642 |
Pitting Corrosion of Titanium Casillas N, Charlebois S, Smyrl WH, White HS |
643 - 647 |
Surface Characterization of RuO2-IrO2-TiO2 Coated Titanium Electrodes Kameyama K, Tsukada K, Yahikozawa K, Takasu Y |
648 - 651 |
Room-Temperature Coloration of Stainless-Steel by Alternating Potential Pulse Method Ogura K, Sakurai K, Uehara S |
652 - 660 |
Application of an Electrochemical Quartz-Crystal Microbalance to a Study of the Anodic Deposition of Pbo2 and Bi-Pbo2 Films on Gold Electrodes Gordon JS, Young VG, Johnson DC |
660 - 663 |
Photoelectrochemical Properties of Anatase and Rutile Films Prepared by the Sol-Gel Method Hamasaki Y, Ohkubo S, Murakami K, Sei H, Nogami G |
664 - 669 |
Effects of Temperature and Powder Morphologies on the Cementation Rate of Copper in Alkaline Zinc Solution Masse N, Piron DL |
669 - 673 |
Electrolytic Codeposition of Ni-Gamma-Al2O3 Thin-Films Webb PR, Robertson NL |
674 - 679 |
Crystallinity and Photoluminescence in Stain-Etched Porous Si Steckl AJ, Xu J, Mogul HC |
679 - 689 |
Anisotropic Chemical-Pattern Etching of Copper Foil .3. Mathematical-Model Georgiadou M, Alkire R |
689 - 690 |
Electrical Charge and HF Concentration-Effect on Porous Silicon Formation Difrancia G, Salerno A |
691 - 697 |
Metal Distribution in Jet Plating Karakus C, Chin DT |
697 - 702 |
On the Electrical-Impedance Due to the Anodic-Dissolution of Silicon in HF Solutions Vanmaekelbergh D, Searson PC |
703 - 708 |
Magnetic-Field Effects in High-Power Batteries .1. The Penetration of an Electric-Field into a Cylindrical Conductor Battaglia V, Newman J |
708 - 713 |
Magnetic-Field Effects in High-Power Batteries .2. Time Constant of a Radial Circuit Terminated by a Cylindrical Cell with Inductance Battaglia V, Newman J |
713 - 717 |
Effect of Iron on the Electrochemical Properties of the Nickel-Hydroxide Electrode Demourguesguerlou L, Delmas C |
718 - 724 |
Rotating-Ring-Disk Electrode and Spectroelectrochemical Studies on the Oxidation of Iron in Alkaline-Solutions Zhang HY, Park SM |
725 - 730 |
Electrocatalytic Oxidation of Glycerol .1. Behavior of Palladium Electrode in Alkaline-Medium Yildiz G, Kadirgan F |
730 - 733 |
Electroless Copper Deposition Process Using Glyoxylic-Acid as a Reducing Agent Honma H, Kobayashi T |
734 - 736 |
Improved Phosphosilicate Glass Passivation Against Cu Contamination Using the Rapid Thermal Annealing Process Miyazaki H, Kojima H, Hiraiwa A, Homma Y, Murakami K |
737 - 741 |
Substrate Doping and Microroughness Effects in Rtp Temperature-Measurement by in-Situ Ellipsometry Sampson RK, Conrad KA, Massoud HZ, Irene EA |
742 - 746 |
C-V Characteristics of Amorphous-Silicon Nitride Films Prepared by Hydrogen Radical-Assisted Plasma Chemical-Vapor-Deposition Yasui K, Takahashi H, Akahane T |
747 - 750 |
Hopping Conduction in Molecular-Beam Epitaxial GaAs Grown at Very-Low Temperatures Look DC, Fang ZQ, Look JW, Sizelove JR |
750 - 754 |
Insight into Gate Oxide Thinning Bellutti P, Lui A |
754 - 758 |
Rapid Thermal Annealing of P-Type Silicon - Correlation Between Deep-Level Transient Spectroscopy and Lifetime Measurements Poggi A, Susi E, Butturi MA, Carotta MC |
759 - 765 |
A Point-Defect Based 2-Dimensional Model of the Evolution of Dislocation Loops in Silicon During Oxidation Park HY, Jones KS, Law ME |
765 - 771 |
Morphological Structure of Silicon-Carbide Grown by Chemical-Vapor-Deposition on Titanium Carbide Using Silane and Ethylene Kruaval GB, Parsons JD |
771 - 777 |
Morphological Structure of Silicon-Carbide, Chemically Vapor-Deposited on Titanium Carbide, Using Ethylene, Carbon-Tetrachloride, and Silicon Tetrachloride Parsons JD, Kruaval GB |
778 - 781 |
Photoelectrochemical Etching of 6H-SiC Shor JS, Kurtz AD |
782 - 786 |
Electronic Conductivity in the La(Cr, Ni)O3 Perovskite System Hofer HE, Schmidberger R |
787 - 795 |
A Kinetic-Study of Titanium Nitride Chemical-Vapor-Deposition Using Nitrogen, Hydrogen, and Titanium Tetrachloride Dekker JP, Vanderput PJ, Veringa HJ, Schoonman J |
796 - 801 |
Characterization of Si-Si Bonding by Wright Etching Horning RD, Mirza A, Martin RR |
802 - 806 |
Chemical Bath Deposition of ZnSe and Cuse Thin-Films Using N,N-Dimethylselenourea Estrada CA, Nair PK, Nair MT, Zingaro RA, Meyers EA |
807 - 809 |
A Galvanic Series for Thin-Film Metallizations and Barrier Layers Commonly Used in the Microelectronics Industry Griffin AJ, Hernandez SE, Brotzen FR, Dunn CF |
810 - 815 |
Thermal Component of the Optical-Response of Thin-Film High-T(C) Superconductors Phelan PE, Hijikata K |
816 - 824 |
The Influence of Thermal Treatments on the Adhesion of Electrolessly Deposited Ni(P) Layers on Alumina Ceramic Severin JW, Hokke R, Vanderwel H, Dewith G |
824 - 842 |
Chemical-Vapor-Deposition of Silicon from Disilane Under Reduced Pressure in a Circular Impinging Jet Reactor - Simulation and Experiments Wang YB, Teyssandier F, Simon J, Feurer R |
843 - 848 |
The Dependence of the Stress of Chemical-Vapor-Deposited Tungsten Films on Deposition Parameters Schmitz J, Kang S, Wolters R, Vandenaker K |
849 - 853 |
Low-Temperature Deposition of Tin Using Tetrakis(Dimethylamido)-Titanium in an Electron-Cyclotron-Resonance Plasma Process Weber A, Nikulski R, Klages CP, Gross ME, Brown WL, Dons E, Charatan RM |
853 - 858 |
Ellipsometric Examination of Structure and Growth-Rate of Metalloorganic Chemical-Vapor-Deposited Ta2O5 Films on Si(100) An CH, Sugimoto K |
L19 - L21 |
The Ternary HCl-Imcl-AlCl3 Ambient-Temperature Molten-Salt System - Expansion of the Electrochemical Window on Proton Addition to a Weakly Basic AlCl3-Imcl Ionic Liquid Campbell JL, Johnson KE |
L21 - L22 |
Reversible Lithium-Graphite Anodes in Room-Temperature Chloroaluminate Melts Carlin RT, Fuller J, Hedenskoog M |
L23 - L24 |
Preparation of Microarray Electrodes by Sonochemical Ablation of Polymer-Films Madigan NA, Hagan CR, Coury LA |
L25 - L26 |
V2O5 Xerogel Films as Intercalation Hosts for Lithium Park HK, Smyrl WH |
L26 - L28 |
Redox Cyclability of a Self-Doped Polyaniline Kim EY, Lee MH, Moon BS, Lee CJ, Rhee SB |
L29 - L30 |
A Novel Synthetic Route to Nb2O5 Thin-Films for Electrochromic Devices Faria RC, Bulhoes LO |
L30 - L33 |
Double-Layer Effects Associated with Surface Reconstruction on a Au (100) Electrode Fawcett WR, Fedurco M, Kovacova Z |
L34 - L34 |
The Early-Stage Oxidation-Kinetics of CeO2 Solcoated Nickel (Vol 140, Pg 2606, 1993) Czerwinski F |
L34 - L34 |
Effects of the Anodic Decomposition of GaAs Particles at the Pt Electrode Interface (Vol 140, Pg 2568, 1993) Chun JH |