901 - 901 |
Special issue: ISMS 2005 - Foreword Iliadis AA, Thompson PE |
902 - 907 |
High performance InP/InAlAs/GaAsSb/InP double heterojunction bipolar transistors Cho SW, Yun JH, Jun D, Song JI, Adesida I, Pan N, Jang JH |
908 - 913 |
Novel reconfigurable semiconductor photonic crystal-MEMS device Zhou WM, Mackie DM, Taysing-Lara M, Dang G, Newman PG, Svensson S |
914 - 919 |
25-nm programmable virtual source/drain MOSFETs using a twin SONOS memory structure Choi WY, Choi BY, Kim DW, Lee CH, Park D, Lee JD, Park BG |
920 - 923 |
Study of leakage-induced photon emission processes in sub-90 nm CMOS devices Weizman Y, Gurfinkel M, Margulis A, Fefer Y, Shapira Y, Baruch E |
924 - 928 |
A novel tri-control gate surrounding gate transistor(TCG-SGT) nonvolatile memory cell for flash memory Ohba T, Nakamura H, Sakuraba H, Masuoka F |
929 - 934 |
Worst case stress conditions for hot carrier induced degradation of p-channel SOI MOSFETs Ioannou DP, Mishra R, Ioannou DE, Liu ST, Hughes HL |
935 - 942 |
Influence of SOI-generated stress on BiCMOS performance Johansson T, Malin BG, Norstrom H, Smith U, Ostling M |
943 - 950 |
Large-signal modeling of SOI MESFETs Balijepalli A, Vijayaraghavan R, Ervin J, Yang J, Islam SK, Thornton TJ |
951 - 958 |
CMOS and post-CMOS on-chip microwave pulse power detectors Jeon W, Melngailis J |
959 - 963 |
CMOS reliability issues for emerging cryogenic Lunar electronics applications Chen TB, Zhu CD, Najafizadeh L, Jun B, Ahmed A, Diestelhorst R, Espinel G, Cressler JD |
964 - 972 |
Analysis and understanding of unique cryogenic phenomena in state-of-the-art SiGeHBTs Liang QQ, Krithivasan R, Ahmed A, Lu Y, Li Y, Cressler JD, Niu GF, Rieh JS, Freeman G, Ahlgren D, Joseph A |
973 - 978 |
Integration of Si/SiGe HBT and Si-based RITD demonstrating controllable negative differential resistance for wireless applications Chung SY, Park SY, Daulton JW, Yu RH, Berger PR, Thompson PE |
979 - 985 |
CMOS integration of epitaxial Gd2O3 high-k gate dielectrics Gottlob HDB, Echtermeyer T, Mollenhauer T, Efavi JK, Schmidt M, Wahlbrink T, Lemme MC, Kurz H, Czernohorsky M, Bugiel E, Osten HJ, Fissel A |
986 - 991 |
Physical and electrical characteristics of high-kappa gate dielectric Hf(1-x)LaxOy Wang XP, Li MF, Chin A, Zhu CX, Shao J, Lu W, Shen XC, Yu XF, Chi R, Shen C, Huan ACH, Pan JS, Du AY, Lo P, Chan DSH, Kwong DL |
992 - 998 |
Gate electrode effects on low-frequency (1/f) noise in p-MOSFETs with high-kappa dielectrics Srinivasan P, Simoen E, Singanamalla R, Yu HY, Claeys C, Misra D |
999 - 1003 |
Highly reliable high-k gate dielectrics with gradual Hf-profile in the HfO2/SiO2 interface region Iwamoto K, Mizubayashi W, Ogawa A, Nabatame T, Satake H, Toriumi A |
1004 - 1011 |
Dramatic reduction of gate leakage current of ultrathin oxides through oxide structure modification Chen Z, Guo J |
1012 - 1015 |
Current-transport properties of atomic-layer-depo sited ultrathin Al2O3 on GaAs Lin HC, Ye PD, Wilk GD |
1016 - 1023 |
Novel dielectrics for gate oxides and surface passivation on GaN Gila BP, Thaler GT, Onstine AH, Hlad M, Gerger A, Herrero A, Allums KK, Stodilka D, Jang S, Kang B, Anderson T, Abernathy CR, Ren F, Pearton SJ |
1024 - 1029 |
Electrical characteristic enhancement of metal-oxide-semiconductor devices by incorporating WON buffer layer at HfTaSiON/Si interface Cheng CL, Chang-Liao KS, Chang HC, Wang TK |
1030 - 1034 |
Fully integrated 512 Mb DRAMs with HSG-merged-AHO cylinder capacitor Kim SG, Hyun CS, Park D, Cho TH, Suk JG, Hong HS, Lee KY, Oh KS |
1035 - 1040 |
Annealing of ion-implanted SiC by laser-pulse-exposure-generated shock-waves Mulpuri KB, Qadri SB, Grun J, Manka CK, Ridgway MC |
1041 - 1045 |
Schottky barrier height in GaN/AlGaN heterostructures Anwar AFM, Faraclas EW |
1046 - 1050 |
Monitoring the self-heating in a high frequency GaNHFET McAlister SP, Bardwell JA, Haffouz S, Tang H |
1051 - 1056 |
AlGaN/GaN HEMTs: Experiment and simulation of DC characteristics Faraclas EW, Anwar AFM |
1057 - 1061 |
High breakdown voltage AlGaN/GaN MIS-HEMT with SiN and TiO2 gate insulator Yagi S, Shimizu M, Inada M, Yamamoto Y, Piao G, Okumura H, Yano Y, Akutsu N, Ohashi H |
1062 - 1072 |
Breaking the theoretical limit of SiC unipolar power device - A simulation study Yu LC, Sheng K |
1073 - 1079 |
High temperature characterization of SiCBJTs for power switching applications Sheng K, Yu LC, Zhang J, Zhao JH |
1080 - 1087 |
Polysilicon TFT circuits on flexible stainless steel foils Troccoli MN, Roudbari AJ, Chuang TK, Hatalis MK |
1088 - 1096 |
Interface characterization of molecular-monolayer/SiO2 based molecular junctions Richter CA, Hacker CA, Richter LJ, Kirillov OA, Suehle JS, Vogel EM |
1097 - 1104 |
Modeling observed capacitance-voltage hysteresis in metal-SiO2-thin film organic semiconductor devices Niemann D, Gunther N, Kwong C, Barycza M, Rahman M |
1105 - 1112 |
Structural and rectifying junction properties of self-assembled ZnO nanoparticles in polystyrene diblock copolymers on (100)Si substrates Ali HA, Iliadis AA, Martinez-Miranda LJ, Lee U |
1113 - 1118 |
Development of high frequency ZnO/SiO2/Si Love mode surface acoustic wave devices Krishnamoorthy S, Iliadis AA |
1119 - 1123 |
Role of low O-2 pressure and growth temperature on electrical transport of PLD grown ZnO thin films on Si substrates Pandis C, Brilis N, Tsamakis D, Ali HA, Krishnamoorthy S, Iliadis AA |
1124 - 1127 |
Microstructural characterization of quantum dots with type-II band alignments Sarney WL, Little JW, Svensson SP |
1128 - 1136 |
Efficient THz generation and frequency upconversion in GaP crystals Ding YJ, Shi W |
1137 - 1140 |
Room temperature lasing of GaAs quantum wire vertical-cavity surface-emitting lasers grown on (775)B GaAs substrates by molecular beam epitaxy Higuchi Y, Osaki S, Kitada T, Shimomura S, Takasuka Y, Ogura M, Hiyamizu S |
1141 - 1149 |
Bandwidth enhancement of Fabry-Perot quantum-well lasers by injection-locking Jin XM, Chuang SL |
1150 - 1155 |
Two-dimensional quantum mechanical modeling for multiple-channel FET Kim JS, Won T |
1156 - 1163 |
Gate line edge roughness amplitude and frequency variation effects on intra die MOS device characteristics Hamadeh E, Gunther NG, Niemann D, Rahman M |
1164 - 1169 |
Quantum mechanical modeling of MOSFET gate leakage for high-k gate dielectrics Wu HX, Zhao Y, White MH |